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Akgün, O.C. (author), Nanbakhsh, K. (author), Giagka, Vasiliki (author), Serdijn, W.A. (author)
For mm-sized implants incorporating silicon integrated circuits, ensuring lifetime operation of the chip within the corrosive environment of the body still remains a critical challenge. For the chip's packaging, various polymeric and thin ceramic coatings have been reported, demonstrating high biocompatibility and barrier properties. Yet, for...
journal article 2020
document
Akgün, O.C. (author), Nanbakhsh, K. (author), Giagka, Vasiliki (author), Serdijn, W.A. (author)
One key obstacle in employing silicon integrated circuits in flexible implants is ensuring a long-term operation of the chip within the wet corrosive environment of the body. For this reason, throughout the years, various biocompatible insulating materials have been proposed, yet, evaluating their long-term encapsulation performance on...
conference paper 2019