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Yun, Minghui (author), Yang, Daoguo (author), Cai, Miao (author), Yan, Haidong (author), Yu, Jiabing (author), Liu, Mengyuan (author), He, Siliang (author), Zhang, Kouchi (author)
Metal-oxide-semiconductor field-effect transistors (MOSFETs) undergo fatigue degradation under high thermal and electrical stresses. This process results in changes in their parasitic parameters, which can be detected using frequency domain reflectometry (FDR). Frequency domain impedance analysis is employed to characterize the various...
journal article 2024
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Cai, Huayang (author), Savenije, Hubert (author), Garel, Erwan (author), Zhang, Xianyi (author), Guo, Leicheng (author), Zhang, Min (author), Liu, Feng (author), Yang, Qingshu (author)
As a tide propagates into the estuary, river discharge affects tidal damping, primarily via a friction term, attenuating tidal motion by increasing the quadratic velocity in the numerator, while reducing the effective friction by increasing the water depth in the denominator. For the first time, we demonstrate a third effect of river discharge...
journal article 2019
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Yang, Ning (author), Yang, Daoguo (author), Zhang, Kouchi (author), Chen, Liangbiao (author), Liu, Dongjing (author), Cai, Miao (author), Fan, Xuejun (author)
The effects of graphene stacking are investigated by comparing the results of methane adsorption energy, electronic performance, and the doping feasibility of five dopants (i.e., B, N, Al, Si, and P) via first-principles theory. Both zigzag and armchair graphenes are considered. It is found that the zigzag graphene with Bernal stacking has...
journal article 2018
document
Li, Shengli (author), Liu, Y. (author), Zhang, H. (author), Cai, Hongming (author), Sun, Fenglian (author), Zhang, Kouchi (author)
In this study, SAC305 and SAC305-0.3Ni solder balls were soldered onto Cu, high temperature treated Cu (H-Cu) and graphene coated Cu (G-Cu) substrates, respectively. The microstructure, the interfacial reaction, and the hardness of the solder joints were investigated. The interfacial intermetallic compound (IMC) is Cu<sub>6</sub>Sn<sub>5</sub...
journal article 2018
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