Low Temperature Sapphire to Silicon Flip Chip Interconnects by Copper Nanoparticle Sintering

The continuous trend to integrate more multi-functions in a package often involves, Heterogeneous Integration of multi-functional blocks in some kind of 3D stacking. The conventional flip chip for die-on-substrate technology applies solder for integration. However, solder joint integration has the disadvantages of restricting height, reflow...

An Alternative Micro LED Mass Transfer Technology: Self-Assembly

Micro LED display technology has been spotlighted as the most promising technology compared to LCD and OLED. Its excellent advantages include higher brightness, self-illumination, higher resolution, lower power consumption, faster response, higher integration, higher stability, thinner thickness, longer life, etc. In terms of the unique benefits...

Polymer Reinforced Solder Paste for Improving Impact Energy Absorption Capability in Micro LED Laser-Assisted Mass Transfer

Micro LED displays offer superior performance compared to traditional LCD and OLED displays. However, challenges in transfer technology, such as high throughput and scalability, must be addressed. Among various mass transfer techniques, stamp transfer and laser-assisted transfer are widely used for Micro LED assembly. The laser-assisted transfer...