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Hou, F. (author), Zhang, Hengyun (author), Huang, Dezhu (author), Fan, J. (author), Liu, Fengman (author), Lin, Tingyu (author), Cao, Liqiang (author), Fan, Xuejun (author), Ferreira, Braham (author), Zhang, Kouchi (author)
In this article, a microchannel thermal management system (MTMS) with the two-phase flow using the refrigerant R1234yf with low global warming potential is presented. The thermal test vehicles (TTVs) were made of either single or multiple thermal test chips embedded in the substrates, which were then attached to the MTMS. The system included...
journal article 2020
document
Zhang, H. (author), Liu, Y. (author), Wang, Lingen (author), Sun, Fenglian (author), Fan, Jiajie (author), Placette, Mark D. (author), Fan, Xuejun (author), Zhang, Kouchi (author)
Modern power electronics has the increased demands in current density and high-temperature reliability. However, these performance factors are limited due to the die attach materials used to affix power dies microchips to electric circuitry. Although several die attach materials and methods exist, nanosilver sintering technology has received...
journal article 2019