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Microstructural and micromechanical characterization of sintered nano-copper bump for flip-chip heterogeneous integration
Nanoindentation characterization of sintered porous Cu nanoparticles used in power electronics packaging – A molecular dynamic simulation study
High-temperature nanoindentation characterization of sintered nano-copper particles used in high power electronics packaging
Mediation of high temperature radiation damage in bcc iron by Au or Cu precipitation
Micromechanical testing and modelling of blast furnace slag cement pastes
Investigation of Pressure Assisted Nanosilver Sintering Process for Application in Power Electronics
Influence of microencapsulated phase change material (PCM) addition on (micro) mechanical properties of cement paste
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