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Chen, Jiaqi (author), Dan, Hancheng (author), Ding, Yongjie (author), Gao, Y. (author), Guo, Meng (author), Guo, Shuaicheng (author), Han, Bingye (author), Hong, Bin (author), Hou, Yue (author), Hu, Chichun (author), Hu, Jing (author), Huyan, Ju (author), Jiang, Jiwang (author), Jiang, Wei (author), Li, Cheng (author), Liu, Pengfei (author), Liu, Yu (author), Liu, Zhuangzhuang (author), Lu, Guoyang (author), Ouyang, Jian (author), Qu, Xin (author), Ren, Dongya (author), Wang, Chao (author), Wang, Chaohui (author), Wang, Dawei (author), Wang, Di (author), Wang, Hainian (author), Wang, Haopeng (author), Xiao, Yue (author), Xing, Chao (author), Xu, Huining (author), Yan, Yu (author), Yang, Xu (author), You, Lingyun (author), You, Zhanping (author), Yu, Bin (author), Yu, Huayang (author), Yu, Huanan (author), Zhang, Henglong (author), Zhang, Jizhe (author), Zhou, Changhong (author), Zhou, Changjun (author), Zhu, Xingyi (author)
Sustainable and resilient pavement infrastructure is critical for current economic and environmental challenges. In the past 10 years, the pavement infrastructure strongly supports the rapid development of the global social economy. New theories, new methods, new technologies and new materials related to pavement engineering are emerging....
review 2021
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Hou, F. (author), Wang, W. (author), Cao, Liqiang (author), Li, Jun (author), Su, Meiying (author), Lin, Tingyu (author), Zhang, Kouchi (author), Ferreira, Jan Abraham (author)
SiC devices are promising for outperforming Si counterparts in high-frequency applications due to its superior material properties. Conventional wirebonded packaging scheme has been one of the most preferred package structures for power modules. However, the technique limits the performance of a SiC power module due to parasitic inductance...
review 2020