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Li, Shizhen (author), Liu, X. (author), Gao, Chenshan (author), Wang, S. (author), Li, Jun (author), Ye, Huaiyu (author), Zhang, Kouchi (author), Wu, Shaohui (author)
The significance of wafer bonding is fundamental to the progression of electronic systems. Common fabrication techniques for Cu pillars play a crucial role in establishing resilient and efficient interconnects within semiconductor devices. It is imperative to explore the potential of nano-copper as an alternative material to overcome limitations...
conference paper 2024
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Liu, Z. (author), Doubrovski, E.L. (author), Geraedts, Jo M.P. (author), Yam, Y (author), Wang, W. (author), Wang, C.C.L. (author)
In this paper, we propose a method to reconstruct a digital 3D model of a stolen/damaged statue using photogrammetric methods. This task is challenging because the number of available photos for a stolen statue is in general very limited – especially the side/back view photos. Besides using standard structure-from-motion and multi-view stereo...
conference paper 2023
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Luopan, Yaxin (author), Han, Rui (author), Zhang, Qinglong (author), Liu, Chi Harold (author), Wang, Guoren (author), Chen, Lydia Y. (author)
Deep Neural Networks (DNNs) have been ubiquitously adopted in internet of things and are becoming an integral of our daily life. When tackling the evolving learning tasks in real world, such as classifying different types of objects, DNNs face the challenge to continually retrain themselves according to the tasks on different edge devices....
conference paper 2023
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Wang, Xinyue (author), Yang, Zhoudong (author), Zhang, Kouchi (author), Zhang, Jing (author), Liu, Pan (author)
With the popularization of wide band-gap power modules in offshore wind power systems and water surface photovoltaic power stations, packaging materials face challenges of corrosion by salt, blended with high humidity. Copper-silver (Cu-Ag) composite sintered paste was proposed by researchers as a novel die-attach material for a lower cost...
conference paper 2023
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Wang, Yiping (author), Li, Xueyuan (author), Liu, Qi (author), Li, Songhao (author), Luan, Tian (author), Li, Z. (author)
The skid-steered vehicle has the advantages of simple structure and strong maneuverability. Its formation driving can effectively improve safety, reduce energy consumption and exert its benefits, and has wide application prospects in military and civilian fields. Differential skid steering has strong horizontal and vertical coupling...
conference paper 2023
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Boonprakong, Nattapat (author), He, G. (author), Gadiraju, Ujwal (author), Van Berkel, Niels (author), Wang, Danding (author), Chen, Si (author), Liu, Jiqun (author), Tag, Benjamin (author), Goncalves, Jorge (author), Dingler, Tilman (author)
AI systems are increasingly incorporated into human decision-making. Yet, human decision-makers are often affected by their cognitive biases. In critical settings, such as medical diagnosis, criminal judgment, or information consumption, these cognitive biases hinder optimal decision outcomes, thereby resulting in dangerous decisions and...
conference paper 2023
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Liu, Minne (author), Ibrahim, Mesfin S. (author), Wen, Minzhen (author), Li, Sheng (author), Wang, An (author), Zhang, Kouchi (author), Fan, J. (author)
Spectral power distribution (SPD) is the radiation power intensity at different wavelengths, containing the most basic photometric and colorimetric performance of the illuminant, which is able to predict the lifetime of LEDs. This paper proposes an SPD model assisted by machine learning algorithms to detect the early failure of white LEDs. The...
conference paper 2023
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Wang, Zhe (author), Wu, Shilong (author), Chen, Hang (author), He, Mao-Kui (author), Du, Jun (author), Lee, Chin-Hui (author), Chen, Jingdong (author), Watanabe, Shinji (author), Siniscalchi, Sabato Marco (author), Scharenborg, O.E. (author), Liu, Diyuan (author)
The Multi-modal Information based Speech Processing (MISP) challenge aims to extend the application of signal processing technology in specific scenarios by promoting the research into wake-up words, speaker diarization, speech recognition, and other technologies. The MISP2022 challenge has two tracks: 1) audio-visual speaker diarization (AVSD),...
conference paper 2023
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Chen, Qinyu (author), Wang, Zuowen (author), Liu, Shih Chii (author), Gao, C. (author)
This paper presents a sparse Change-Based Convolutional Long Short-Term Memory (CB-ConvLSTM) model for event-based eye tracking, key for next-generation wearable healthcare technology such as AR/VR headsets. We leverage the benefits of retina-inspired event cameras, namely their low-latency response and sparse output event stream, over...
conference paper 2023
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Zhang, Qinglong (author), Han, Rui (author), Liu, Chi Harold (author), Wang, Guoren (author), Chen, Lydia Y. (author)
Vision applications powered by deep neural networks (DNNs) are widely deployed on edge devices and solve the learning tasks of incoming data streams whose class label and input feature continuously evolve, known as domain shift. Despite its prominent presence in real-world edge scenarios, existing benchmarks used by domain adaptation methods...
conference paper 2023
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Liu, Bin (author), Wang, Q. (author), Pollin, Sofie (author)
This paper presents a novel transparent amplifying intelligent surface (TAIS) architecture for uplink enhancement in indoor-to-outdoor mmWave communications. The TAIS is an amplifier-based transmissive intelligent surface that can refract and amplify the incident signal, instead of only refracting it with adjustable phase shift by most passive...
conference paper 2023
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Wang, S. (author), Tan, Yanlong (author), Liu, Xu (author), Li, Shizhen (author), Liu, Ke (author), Yuan, Wucheng (author), Li, Tao (author), Zhang, Kouchi (author), French, P.J. (author), Ye, Huaiyu (author), Tan, Chunjian (author)
In this article, the avalanche withstand capability and transient failure model of commercial 1200 V asymmetric trench gate SiC MOSFETs are investigated by experiment and simulation under single-pulse unclamped inductive switching (UIS) conditions. The limiting avalanche current and limiting avalanche energy of the device are determined by...
conference paper 2023
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Li, Shizhen (author), Jiang, Jing (author), Liu, X. (author), Wang, S. (author), Zhang, Zhonghua (author), Ye, Huaiyu (author)
Substrate metallization is a crucial factor affecting the mechanical properties of sintered nanoparticles in microelectronics applications, as it is essential for ensuring good adhesion between the substrate and the sintered material. In this study, we investigated the influence of metallization on pressure-assisted nanocopper sintering and...
conference paper 2023
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Wang, Zhongkai (author), Choi, Minsoo (author), Kwon, Paul (author), Lee, Kyoungtae (author), Yin, Bozhi (author), Liu, Zhaokai (author), Park, Kwanseo (author), Biswas, Ayan (author), Du, S. (author)
This paper presents a complete 200Gb/s PAM-4 transmitter (TX) in 28nm CMOS technology. The transmitter features a hybrid sub-sampling PLL (SSPLL) with a delta-sigma (?S) modulator, clock distribution network with flexible timing control, and data path with a hybrid 5-tap Feed-Forward Equalizer (FFE) and T-coil for bandwidth extension. The...
conference paper 2022
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Wang, Xinyue (author), Zeng, Zejun (author), Zhang, Jing (author), Zhang, Kouchi (author), Liu, Pan (author)
With the increasing application of wide bandgap materials such as silicon carbide and gallium nitride in power devices, the working temperature of power devices has been pushed further. Therefore, it brings higher requirements for packaging materials. Sintered silver is a widely accepted chip connection material. However, silver suffers from...
conference paper 2022
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Tan, C. (author), Wang, S. (author), Liu, X. (author), Jiang, Jing (author), Zhang, Kouchi (author), Ye, H. (author)
On the basis of the development and application requirements of flexible DC transmission techniques, a 1 kA/10 kV half-bridge IGBT press-pack module is studied. The module is composed of three subunits in series, and each subunit consists of IGBT chips in parallel. In order to solve the problem of chips failure caused by non-uniform rigid...
conference paper 2022
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Wang, Zhongkai (author), Choi, Minsoo (author), Wright, John (author), Lee, Kyoungtae (author), Liu, Zhaokai (author), Yin, Bozhi (author), Han, Jaeduk (author), Du, S. (author), Alon, Elad (author)
We present a ring-oscillator-based sub-sampling phase-locked loop (PLL) using a generator-based design flow. A hybrid loop with a delta-sigma ($\Delta \Sigma$) modulator is applied to reduce the loop filter (LF) area and the control ripple. The generator automatically produces the ring oscillator and PLL to meet the provided specifications. The...
conference paper 2022
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Li, Z. (author), Lin, Yunlong (author), Cheng, Gong (author), Wang, X. (author), Liu, Qi (author), Gong, Jianwei (author), Lu, Chao (author)
Precisely modeling interactions and accurately predicting trajectories of surrounding vehicles are essential to the decision-making and path-planning of intelligent vehicles. This paper proposes a novel framework based on ensemble learning to improve the performance of trajectory predictions in interactive scenarios. The framework is termed...
conference paper 2022
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Han, Rui (author), Wen, Shilin (author), Liu, Chi Harold (author), Yuan, Ye (author), Wang, Guoren (author), Chen, Lydia Y. (author)
Edge-cloud jobs are rapidly prevailing in many application domains, posing the challenge of using both resource-strenuous edge devices and elastic cloud resources. Efficient resource allocation on such jobs via scheduling algorithms is essential to guarantee their performance, e.g. latency. Deep reinforcement learning (DRL) is increasingly...
conference paper 2022
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Liu, Ke (author), Yuan, Wucheng (author), Wang, S. (author), Tan, C. (author), Ye, H. (author)
In this paper, a novel bubble-shift super junction (SJ) MOSFET structure is proposed, and its main static electrical parameters and reverse recovery characteristics are simulated by TCAD software tool. By designing the P-pillar ion implantation windows with a certain offset, the bubble-shift SJ-MOSFET contains a curved pillar region in the upper...
conference paper 2022
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