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Luo, Bixiong (author), Zhang, Li (author), Peng, Kaijun (author), Ren, Zongdong (author), Li, Xiaoyu (author), Sun, Yanqian (author), Cai, Yanfeng (author), Tu, Jin (author)
conference paper 2024
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Li, Xinqi (author), Zhang, Y. (author), Zhao, Y. (author), van Gemert, J.C. (author), Tao, Q. (author)
Quantitative cardiac magnetic resonance imaging (MRI) is an increasingly important diagnostic tool for cardiovascular diseases. Yet, co-registration of all baseline images within the quantitative MRI sequence is essential for the accuracy and precision of quantitative maps. However, co-registering all baseline images from a quantitative...
conference paper 2024
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Li, Shizhen (author), Liu, X. (author), Gao, Chenshan (author), Wang, S. (author), Li, Jun (author), Ye, Huaiyu (author), Zhang, Kouchi (author), Wu, Shaohui (author)
The significance of wafer bonding is fundamental to the progression of electronic systems. Common fabrication techniques for Cu pillars play a crucial role in establishing resilient and efficient interconnects within semiconductor devices. It is imperative to explore the potential of nano-copper as an alternative material to overcome limitations...
conference paper 2024
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Li, Wenyu (author), Chen, Wei (author), Jiang, Jing (author), Wang, Wenbo (author), Fan, Xuejun (author), Zhang, Kouchi (author), Fan, Jiajie (author)
Thermal management has always played a significant role in power module design. Double-sided heat dissipation is more efficient at transferring heat than the traditional package. Although there are several thermal modeling approaches to power modules, the application of the numerical models, which are computationally fast and accurate, has...
conference paper 2024
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Li, J. (author), Vollebregt, S. (author), Zhang, Y. (author), Shekhar, A. (author), May, Alexander (author), van Driel, W.D. (author), Zhang, Kouchi (author)
Due to the deficient passivation of the interface between silicon carbide and silicon dioxide, the defect-induced capture and release of trapped charges triggered by external Bias Temperature Stress (BTS) leads to parameter shifts and degraded device performance. This study models the trap-induced transient current in silicon carbide metal-oxide...
conference paper 2024
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Liu, Xu (author), Hu, D. (author), Li, Z. (author), Fan, Xuejun (author), Zhang, Kouchi (author), Fan, J. (author)
The nano-copper particles are widely used in the sintering processes of packaging wide bandgap semiconductors. Despite the significant success in the industry, the mechanism bridging the sintering process to the mechanical properties of sintered nano-copper is not yet well-modeled. In this paper, the impacts of different sintering temperatures...
conference paper 2024
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Hu, D. (author), Wang, Chieh (author), Li, Z. (author), Gupta, N. (author), Poelma, René H. (author), Shi, Ziliang (author), Fan, J. (author), Zhang, Kouchi (author)
Driven by the increasing demand for high-power systems, ceramic substrates have received more attention for handling higher power density. Warpage in active metal brazed (AMB) ceramic substrate becomes a critical issue as it can deteriorate the reliability performance. This study comprises three phases, including investigation of the cause of...
conference paper 2024
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Ruzzi, Alessandro (author), Shi, X. (author), Wang, Xi (author), Li, Gengyan (author), De Mello, Shalini (author), Chang, Hyung Jin (author), Zhang, X. (author), Hilliges, Otmar (author)
We propose GazeNeRF, a 3D-aware method for the task of gaze redirection. Existing gaze redirection methods operate on 2D images and struggle to generate 3D consistent results. Instead, we build on the intuition that the face region and eyeballs are separate 3D structures that move in a coordinated yet independent fashion. Our method leverages...
conference paper 2023
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Liu, Minne (author), Ibrahim, Mesfin S. (author), Wen, Minzhen (author), Li, Sheng (author), Wang, An (author), Zhang, Kouchi (author), Fan, J. (author)
Spectral power distribution (SPD) is the radiation power intensity at different wavelengths, containing the most basic photometric and colorimetric performance of the illuminant, which is able to predict the lifetime of LEDs. This paper proposes an SPD model assisted by machine learning algorithms to detect the early failure of white LEDs. The...
conference paper 2023
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Ji, Liangzheng (author), Li, Zaihuan (author), Zhang, Kouchi (author), Zhang, Jing (author), Liu, Pan (author)
Micro LED displays offer superior performance compared to traditional LCD and OLED displays. However, challenges in transfer technology, such as high throughput and scalability, must be addressed. Among various mass transfer techniques, stamp transfer and laser-assisted transfer are widely used for Micro LED assembly. The laser-assisted transfer...
conference paper 2023
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Zhang, Xiaoyu (author), Li, Jianping (author), Chi, Po Wei (author), Chandrasegaran, R.S.K. (author), Ma, Kwan Liu (author)
With the most advanced natural language processing and artificial intelligence approaches, effective summarization of long and multi-topic documents - such as academic papers - for readers from different domains still remains a challenge. To address this, we introduce ConceptEVA, a mixed-initiative approach to generate, evaluate, and...
conference paper 2023
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Leibbrandt, Louise (author), Zhang, S. (author), Roelvink, M.A.T. (author), Bergkamp, Stan (author), Li, Xinqi (author), Bisschop, Lieselot (author), Wingerde, Karin van (author), Wang, H. (author)
This paper aims to understand to what extent the amount of drug (e.g., cocaine) trafficking per country can be explained and predicted using the global shipping network. We propose three distinct network approaches, based on topological centrality metrics, Susceptible-Infected-Susceptible spreading process and a flow optimization model of...
conference paper 2023
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Hu, D. (author), Li, Z. (author), Fan, J. (author), Zhang, Kouchi (author)
As a critical part of speeding up industrial electrification, power electronics, and its packaging technology are undergoing rapid development. Cu nanoparticle sintering technology has therefore received extensive attention for its excellent performance in the die-attachment layer, where the mechanical properties are essential to be known for...
conference paper 2023
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Li, Shizhen (author), Jiang, Jing (author), Liu, X. (author), Wang, S. (author), Zhang, Zhonghua (author), Ye, Huaiyu (author)
Substrate metallization is a crucial factor affecting the mechanical properties of sintered nanoparticles in microelectronics applications, as it is essential for ensuring good adhesion between the substrate and the sintered material. In this study, we investigated the influence of metallization on pressure-assisted nanocopper sintering and...
conference paper 2023
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Wang, S. (author), Tan, Yanlong (author), Liu, Xu (author), Li, Shizhen (author), Liu, Ke (author), Yuan, Wucheng (author), Li, Tao (author), Zhang, Kouchi (author), French, P.J. (author), Ye, Huaiyu (author), Tan, Chunjian (author)
In this article, the avalanche withstand capability and transient failure model of commercial 1200 V asymmetric trench gate SiC MOSFETs are investigated by experiment and simulation under single-pulse unclamped inductive switching (UIS) conditions. The limiting avalanche current and limiting avalanche energy of the device are determined by...
conference paper 2023
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He, C. (author), Yang, Z. (author), Zhang, P. (author), Li, S. (author), Naeimi, M. (author), Li, Z. (author)
Polygonal wear is a common type of damage on the railway wheel tread, which could induce wheel-rail impacts and further components failure. This study presents a finite element (FE) thermomechanical model to investigate the causes of wheel polygonal wear. The FE model is able to cope with three possible causes of polygonal wear: thermal...
conference paper 2022
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Li, Meng (author), Gao, Jianbo (author), Zhang, Zijian (author), Fu, Chaoping (author), Lal, C. (author), Conti, M. (author)
Shortest distance queries over large-scale graphs bring great benefits to various applications, i.e., save planning time and travelling expenses. To protect the sensitive nodes and edges in the graph, a user outsources an encrypted graph to an untrusted server without losing the query ability. However, no prior work has considered the user...
conference paper 2022
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Li, Shizhen (author), Liu, X. (author), Jiang, Jing (author), Tan, C. (author), Gao, Chenshan (author), Liu, Yang (author), Ye, H. (author), Zhang, Kouchi (author)
Cu-Ag core-shell (CS) nanoparticle (NP) is considered as a cost-effective alternative material to nano silver sintering material in die attachment application. To further reduce the cost, the thickness of the Ag shell can be adjusted. Whereas the shell thickness will also affect the thermal stability of the Cu-Ag CSNPs. In this study, molecular...
conference paper 2022
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Li, Xiao (author), Tang, Jiuyang (author), Zhao, Jiayan (author), Li, Jinbing (author), Zhang, Kouchi (author), Liu, Pan (author)
With the development of 5G communication technology and the rise of power semiconductors, the switching frequency of the circuit keeps increasing, which pushes for miniaturization of power modules and related components. Therefore, in this paper, a one-step molding technology was proposed for a DC/DC buck converter power module. We proposed a...
conference paper 2022
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Lu, Zhiwei (author), Li, Xiaoling (author), Wei, Jinxiu (author), Cai, Miao (author), Yang, Daoguo (author), Zhang, Kouchi (author)
UVC-LED is known as a deep ultraviolet LED. The application development and disinfection efficiency of UVC-LED modules are important problems encountered when UVC-LED products are rushed into commercialization. In this article, a specific disinfection experiment with a UVC-LED module was combined to analyze the disinfection efficiency. UVC-LEDs...
conference paper 2022
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