A Thin and Low-Inductance 1200 V SiC MOSFET Fan-Out Panel-Level Packaging With Thermal Cycling Reliability Evaluation

SiC MOSFET is mainly characterized by the higher electric breakdown field, higher thermal conductivity, and lower switching loss enabling high breakdown voltage, high-temperature operation, and high switching frequency. However, their performances are considerably limited by the high parasitic inductance and poor heat dissipation capabilities...

Antimicrobial properties dependence on the composition and architecture of copper-alumina coatings prepared by plasma electrolytic oxidation (PEO)

This study presents environmentally friendly and low-cost synthetic routes to produce antimicrobial coatings over 5052 Al alloy based on plasma electrolytic oxidation (PEO) technology. Two methodologies were explored: the decoration with copper and anodic doping with copper ions. The porous oxide layers produced in silicate media presented...

Electromigration-induced local dewetting in Cu films

The continuous downscaling of microelectronics has introduced many reliability issues on interconnect. Electromigration and dewetting are major reliability concerns in high-temperature micro- and nanoscale devices. In this paper, the local dewetting of copper thin film during the electromigration test was first found and investigated. When...

Hybrid Analytical Model for AC Copper Loss Computation of Hairpin Winding

This article proposes a hybrid analytical model (HAM) for predicting ac copper losses in hairpin windings. The HAM combines the nonlinear semi-analytical model (SAM) and the 1-D ac copper loss computation model to solve the inaccurate boundary solutions of the 1-D ac copper loss computation model when magnetic saturation occurs in the stator...

Low-voltage anodizing of copper in sodium bicarbonate solutions

The low-voltage (< 5 V) anodization of copper in aqueous solutions of sodium bicarbonate was studied for the first time. As demonstrated, this method leads to the formation of microstructures on a copper surface, that are composed of malachite (CuCO₃·Cu(OH)₂). Moreover, by tuning the operating conditions, i.e.,...

Copper promotion of chromium-doped iron oxide water-gas shift catalysts under industrially relevant conditions

Copper promotion of chromium-doped iron oxide prepared via co-precipitation for high-temperature water–gas shift (WGS) catalysis is investigated. Low-temperature Mössbauer spectra demonstrate that copper doping delays hematite (α-Fe₂O₃) formation in the fresh catalyst, favoring the formation of small crystallites of...

Single-crystal copper films on sapphire

Single-crystal copper films on sapphire have recently been reported upon in relation to graphene growth on these films. In the present paper the kinetics of the formation of single crystal copper films is investigated. We demonstrate the importance of heating the sapphire substrate in 1000 hPa oxygen, followed by a fast cooling prior to...

Selective dehydration of glycerol on copper based catalysts

Glycerol is produced in large quantities as a byproduct of biodiesel, and among others hydroxyacetone (acetol) is an important commodity obtained from glycerol. Metallic Cu has been identified as active site for the dehydration of glycerol to hydroxyacetone and acid and metal sites are known to influence the catalytic performance. In this...

Interfacial properties of Cu/SiO2 using a multiscale modelling approach in electronic packages

Interfacial properties of Cu/SiO2 in semiconductor devices has continued to be the subject of challenging study for many years because of its difficulties in experimentally quantifying the critical strength of interface. In this paper, a multi-scale modeling approach is built to characterize the interfacial properties between Cu and SiO2. In...

Interfacial Failure Characterization of Electronic Packaging Component Using a Multiscale Modelling Approach

Interfacial properties of Cu/SiO₂ in semiconductor devices has been a challenging study for many years because of its difficulties in experimentally quantifying the critical strength of interface. In this paper, a multi-scale modeling approach is built to characterize the interfacial properties between Cu and SiO₂. The...

Analysing the uncertain future of copper with three exploratory system dynamics models

High copper prices, the prospect of a transition to a more sustainable energy mix and increasing copper demands from emerging economies have not led to an in-creased attention to the base metal copper in mineral scarcity discussions. The copper system is well documented, but especially regarding the demand of copper many uncertainties exist. In...