Multi Physics Simulation of Wafer Bonding with Nano Copper Paste

The significance of wafer bonding is fundamental to the progression of electronic systems. Common fabrication techniques for Cu pillars play a crucial role in establishing resilient and efficient interconnects within semiconductor devices. It is imperative to explore the potential of nano-copper as an alternative material to overcome limitations...

Analysis of Metallization Effects of Pressure-Assisted Cu Nanoparticle Sintering on DBC by Experiment and Nanoscale Simulation

Substrate metallization is a crucial factor affecting the mechanical properties of sintered nanoparticles in microelectronics applications, as it is essential for ensuring good adhesion between the substrate and the sintered material. In this study, we investigated the influence of metallization on pressure-assisted nanocopper sintering and...

Investigation on Transient Failure Mode of Asymmetric Trench Gate SiC MOSFET Under Single-Pulse Avalanche Stress

In this article, the avalanche withstand capability and transient failure model of commercial 1200 V asymmetric trench gate SiC MOSFETs are investigated by experiment and simulation under single-pulse unclamped inductive switching (UIS) conditions. The limiting avalanche current and limiting avalanche energy of the device are determined by...

Effects of shell thickness on the thermal stability of Cu-Ag core-shell nanoparticles: A molecular dynamics study

Cu-Ag core-shell (CS) nanoparticle (NP) is considered as a cost-effective alternative material to nano silver sintering material in die attachment application. To further reduce the cost, the thickness of the Ag shell can be adjusted. Whereas the shell thickness will also affect the thermal stability of the Cu-Ag CSNPs. In this study, molecular...

Mitigating the autogenous shrinkage of alkali-activated slag by internal curing

Alkali activated slag (AAS) has shown promising potential to replace ordinary Portland cement as a binder material. Synthesized from industrial by-products, AAS can show high strength, thermal resistance and good durability. However, AAS has been reported to exhibit high autogenous shrinkage. Autogenous shrinkage is a critical issue for building...

Mitigating the autogenous shrinkage of alkali-activated slag by internal curing

Alkali activated slag (AAS) has shown promising potential to replace ordinary Portland cement as a binder material. Synthesized from industrial by-products, AAS can show high strength, thermal resistance and good durability. However, AAS has been reported to exhibit high autogenous shrinkage. Autogenous shrinkage is a critical issue for building...

Fabrication of Nanoslits with <111> Etching TSWE Method

In this paper, we report a modified three step anisotropic wet etching (TSWE) method to fabricate solid-state silicon nanoslits. The slit-opening process is performed by &lt;111&gt; crystal plane etching. The etching rate of the &lt;111&gt; crystal plane is reasonably slow as it is only 1/45 of the &lt;100&gt; etching rate, thus allowing and...

Isothermal calorimetric study on the heat evolution and the apparent activation energy of alkali-activated slag/fly ash pastes

Alkali-activated slag/fly ash (AASF) as an environmental-friendly binder system for construction materials has recently attracted great attention from both academic and industrial communities. Towards its wider engineering application, it is crucial to have a better understanding of the temperature induced effects by different curing regimes and...