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Li, Shizhen (author), Liu, X. (author), Gao, Chenshan (author), Wang, S. (author), Li, Jun (author), Ye, Huaiyu (author), Zhang, Kouchi (author), Wu, Shaohui (author)
The significance of wafer bonding is fundamental to the progression of electronic systems. Common fabrication techniques for Cu pillars play a crucial role in establishing resilient and efficient interconnects within semiconductor devices. It is imperative to explore the potential of nano-copper as an alternative material to overcome limitations...
conference paper 2024
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Tan, C. (author), Wang, S. (author), Yang, Huiru (author), Huang, Qianming (author), Li, Shizhen (author), Liu, X. (author), Ye, H. (author), Zhang, Kouchi (author)
Short-wave ultraviolet (also called UVC) irradiation is a well-adopted method of viral inactivation due to its ability to damage genetic material. A fundamental problem with the UVC inactivation method is that its mechanism of action on viruses is still unknown at the molecular level. To address this problem, herein we investigate the...
journal article 2023
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Liu, Ke (author), Tan, C. (author), Li, Shizhen (author), Yuan, Wucheng (author), Liu, X. (author), Zhang, Kouchi (author), French, P.J. (author), Ye, H. (author), Wang, S. (author)
This paper proposes and simulates research on the reverse recovery characteristics of two novel superjunction (SJ) MOSFETs by adjusting the doping profile. In the manufacturing process of the SJ MOSFET using multilayer epitaxial deposition (MED), the position and concentration of each Boron bubble can be adjusted by designing different doping...
journal article 2023
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Xie, F. (author), Hao, Zhiguo (author), Ye, Dongmeng (author), Yang, Songhao (author), Li, Chuanxi (author), Dai, Guoan (author), Zhang, Baohui (author), Wang, Ting (author)
The existing protection techniques for high-voltage direct-current (HVDC) grids suffer from several shortcomings such as high sampling frequency, poor robustness, and reliance on simulation for threshold setting. To solve these problems, this paper proposes a non-unit protection method for modular multilevel converter (MMC)-based HVDC grids...
journal article 2023
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Wang, S. (author), Yang, Huiru (author), Zong, Qihang (author), Huang, Qianming (author), Tan, C. (author), Gao, Chenshan (author), Li, Shizhen (author), Ye, H. (author), Zhang, Kouchi (author), French, P.J. (author)
In recent years, metal crack-based stretchable flexible strain sensors have attracted significant attention in wearable device applications due to their extremely high sensitivity. However, the tradeoff between sensitivity and detection range has been an intractable dilemma, severely limiting their practical applications. Herein, we propose a...
journal article 2023
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Li, Shizhen (author), Jiang, Jing (author), Liu, X. (author), Wang, S. (author), Zhang, Zhonghua (author), Ye, Huaiyu (author)
Substrate metallization is a crucial factor affecting the mechanical properties of sintered nanoparticles in microelectronics applications, as it is essential for ensuring good adhesion between the substrate and the sintered material. In this study, we investigated the influence of metallization on pressure-assisted nanocopper sintering and...
conference paper 2023
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Wang, S. (author), Tan, Yanlong (author), Liu, Xu (author), Li, Shizhen (author), Liu, Ke (author), Yuan, Wucheng (author), Li, Tao (author), Zhang, Kouchi (author), French, P.J. (author), Ye, Huaiyu (author), Tan, Chunjian (author)
In this article, the avalanche withstand capability and transient failure model of commercial 1200 V asymmetric trench gate SiC MOSFETs are investigated by experiment and simulation under single-pulse unclamped inductive switching (UIS) conditions. The limiting avalanche current and limiting avalanche energy of the device are determined by...
conference paper 2023
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Jiang, Jing (author), Wang, S. (author), Liu, X. (author), Liu, Jianhui (author), Li, Jun (author), Zhou, Dexiang (author), Zhang, Kouchi (author), Ye, H. (author), Tan, C. (author)
High electric-field stress is an effective solution to the recovery of irradiated devices. In this paper, the dependence of the recovery level on the magnitude of gate voltage and duration is investigated. Compared with the scheme of high gate-bias voltage with a short stress time, the transfer characteristics are significantly recovered by...
journal article 2022
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Wang, Xiao Lin (author), Zhong, Yuanguang (author), Li, L. (author), Xie, Wei (author), Ye, Zhi Sheng (author)
Problem definition: Warranty reserves are funds used to fulfill future warranty obligations for a product. In this paper, we investigate the warranty reserve planning problem faced by a manufacturing firm who manages warranties for multiple products. Academic/practical relevance: It is nontrivial to determine a proper amount of reserves to...
journal article 2022
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Tan, C. (author), Wang, S. (author), Yang, Huiru (author), Huang, Qianming (author), Li, Shizhen (author), Liu, X. (author), Ye, H. (author), Zhang, Kouchi (author)
Recent reports focus on the hydrogenation engineering of monolayer boron phosphide and simultaneously explore its promising applications in nanoelectronics. Coupling density functional theory and finite element method, we investigate the bowtie triangle ring microstructure composed of boron phosphide with hydrogenation based on structural and...
journal article 2022
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Li, Shizhen (author), Liu, X. (author), Fan, Jiajie (author), Tan, C. (author), Wang, S. (author), Xie, Bin (author), Ye, H. (author)
The wide-bandgap semiconductors represented by GaN have a broad application prospect because of their high service temperature and high switch frequency. Quad-Flat-No-Lead (QFN) Package is currently one of the mainstream packaging methods due to its low cost and high efficiency. However, the low reliability of QFN used in GaN devices is still...
conference paper 2022
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Tan, C. (author), Wang, S. (author), Li, Shizhen (author), Liu, X. (author), Wei, Jia (author), Zhang, Kouchi (author), Ye, H. (author)
Owing to the outstanding physical properties of graphene, its biosensing applications implemented by the terahertz metasurface are widely concerned and studied. Here, we present a novel design of the graphene metasurface, which consists of an individual graphene ring and an H-shaped graphene structure. The graphene metasurface exhibits a dual...
journal article 2022
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Han, Rui (author), Liu, Chi Harold (author), Li, Shilin (author), Chen, Lydia Y. (author), Wang, Guoren (author), Tang, Jian (author), Ye, Jieping (author)
The core of many large-scale machine learning (ML) applications, such as neural networks (NN), support vector machine (SVM), and convolutional neural network (CNN), is the training algorithm that iteratively updates model parameters by processing massive datasets. From a plethora of studies aiming at accelerating ML, being data...
journal article 2019
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Qu, Zuopeng (author), Wang, Lei (author), Tang, H. (author), Ye, H. (author), Li, Meicheng (author)
In this paper, four composite coatings of nano-SnS/polyvinylbutyral (PVB), nano-MoS<sub>2</sub>/PVB, nano-SnS-Zn/PVB, and nano-MoS<sub>2</sub>-Zn/PVB were prepared, and their anti-corrosion mechanism was analyzed by experimental and theoretical calculations. The results of the electrochemical experiments show that the effect of nano-MoS<sub>2...
journal article 2019
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Han, Haoya (author), Li, Li (author), Tian, Yuchuan (author), Wang, Yunwei (author), Ye, Zhishuang (author), Yang, Qingsong (author), Wang, Y. (author), Von Klitzing, Regine (author), Guo, Xuhong (author)
Hollow silica nanoparticles were prepared through generating a silica layer in spherical polyelectrolyte nanogels (SPN), which consisted of a solid core of polystyrene (PS) and a shell of crosslinked poly(acrylic acid) (PAA), followed by removing the PS core via solvent dissolution. Small angle X-ray scattering (SAXS) in combination with TEM...
journal article 2017
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