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Li, Shizhen (author), Liu, X. (author), Gao, Chenshan (author), Wang, S. (author), Li, Jun (author), Ye, Huaiyu (author), Zhang, Kouchi (author), Wu, Shaohui (author)
The significance of wafer bonding is fundamental to the progression of electronic systems. Common fabrication techniques for Cu pillars play a crucial role in establishing resilient and efficient interconnects within semiconductor devices. It is imperative to explore the potential of nano-copper as an alternative material to overcome limitations...
conference paper 2024
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Wang, Zhe (author), Wu, Shilong (author), Chen, Hang (author), He, Mao-Kui (author), Du, Jun (author), Lee, Chin-Hui (author), Chen, Jingdong (author), Watanabe, Shinji (author), Siniscalchi, Sabato Marco (author), Scharenborg, O.E. (author), Liu, Diyuan (author)
The Multi-modal Information based Speech Processing (MISP) challenge aims to extend the application of signal processing technology in specific scenarios by promoting the research into wake-up words, speaker diarization, speech recognition, and other technologies. The MISP2022 challenge has two tracks: 1) audio-visual speaker diarization (AVSD),...
conference paper 2023
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Liu, Qi (author), Li, Z. (author), Li, Xueyuan (author), Wu, Jingda (author), Yuan, Shihua (author)
A reliable multi-agent decision-making system is highly demanded for safe and efficient operations of connected and autonomous vehicles (CAVs). In order to represent the mutual effects between vehicles and model the dynamic traffic environments, this research proposes an integrated and open-source framework to realize different Graph...
conference paper 2022
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Lv, Guoping (author), Yan, Haidong (author), Yan, Haidong (author), Yang, Daoguo (author), Wu, Xinke (author), Sheng, Kuang (author), Liu, Chaohui (author), Zhang, Yakun (author), Zhang, Kouchi (author)
As a key heat-dissipating and electrical interconnecting component in high-temperature power modules, die-attach and substrate-attach layers play an important role in effectively reducing the thermal resistance and improving the long-term reliability. Traditional substrate-attach materials limit the high-temperature applications of packaging...
conference paper 2022
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Wu, Xintong (author), Huang, Haoliang (author), Liu, Hao (author), Hu, Jie (author), Wei, Jiangxiong (author), Yu, Qijun (author)
In this study, a new concept on self healing of cracks that the ingressive ions in the crack is chemically bound to improve the self-healing efficiency was proposed for cracked cementitious materials in a marine environment. Thermodynamic modeling was performed to determine the appropriate masses and ratio of Ca2+ and Al3+ provided by chemical...
conference paper 2021
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Wu, Yue (author), Liu, Xiuming (author), Li, Q. (author), Chen, Boxuan (author), Luo, Peng (author), Pronk, Arno (author), Mergny, Elke (author)
By using inflatable moulds and then spraying cellulose-water mixture, one ice dome and two ice towers were built in Harbin in December 2016. During the whole process, form-finding of the inflatable moulds as well as the construction of these ice composite shell structures are very important for the final results.<br/>The mould for the ice dome...
conference paper 2017
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Lu, W. (author), Liu, A. (author), Wang, H. (author), Wu, Z. (author)
While heated discussions have been directed towards various innovative procurement systems such as PPP, PFI, and BOT that carry the great expectation to help materialise the projects and deliver value to the society, a procurement system named agent-construction system (ACS or in Chinese Dai Jian Zhi) is being prevailing in China’s public...
conference paper 2011
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Liu, C. (author), Emadi, A. (author), Wu, H. (author), De Graaf, G. (author), Wolffenbuttel, R.F. (author)
A linear array of 128 Active Pixel Sensors has been developed in standard CMOS technology and a Linear Variable Optical Filter (LVOF) is added using CMOS-compatible post-process, resulting in a single chip highly-integrated highresolution microspectrometer. The optical requirements imposed by the LVOF result in photodetectors with small pitch...
conference paper 2010
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