Measuring residual stresses in individual on-chip interconnects using synchrotron nanodiffraction

A 72-Channel Resistive-and-Capacitive Sensor-Interface Chip With Noise-Orthogonalizing and Pad-Sharing Techniques

Microscopic fracture toughness of notched porous sintered Cu micro-cantilevers for power electronics packaging

Investigating Mechanical Properties of Silicon Carbide Coated Carbon Nanotube Composite at Elevated Temperatures

Multi-parameters optimization for electromigration in WLCSP solder bumps

Hierarchical Motion Planning and Tracking for Autonomous Vehicles Using Global Heuristic Based Potential Field and Reinforcement Learning Based Predictive Control

Speed and heading control-based collision avoidance for a ship towing system

Connecting the macroscopic and mesoscopic properties of sintered silver nanoparticles by crystal plasticity finite element method

High temperature viscoplastic deformation behavior of sintered nanocopper paste used in power electronics packaging: Insights from constitutive and multi-scale modelling

Low Temperature Fine Pitch All-Copper Interconnects Combining Photopatternable Underfill Films

High-temperature creep properties of a novel solder material and its thermal fatigue properties under potting material

Microstructural and micromechanical characterization of sintered nano-copper bump for flip-chip heterogeneous integration

Reviving the rock-salt phases in Ni-rich layered cathodes by mechano-electrochemistry in all-solid-state batteries

Micro-cantilever Bending Test of Sintered Cu nanoparticles for Power Electronic Devices

Secure Logistic Regression for Vertical Federated Learning

A Crystal-Less Clock Generation Technique for Battery-Free Wireless Systems

Collision prevention of ship towing operation under environmental disturbance

Flexible Collision-free Platooning Method for Unmanned Surface Vehicle with Experimental Validations

Luminous performances characterization of YAG: Ce3+ phosphor/silicone composites using both reflective and transmissive laser excitations

A 2m-Range 711uW Body Channel Communication Transceiver Featuring Dynamically-Sampling Bias-Free Interface Front End