Identifying the Design Feature That Causes Project Delay in DfMA: A Dominant Element Analysis Method for Project Scheduling

A Systematic Umbrella Review on Computational Thinking Assessment in Higher Education

Polarimetric Calibration of an FMCW Doppler Radar with Dual-Orthogonal Signals

Molecular dynamics simulations on mechanical behaviors of sintered nanocopper in power electronics packaging

Impact of fast-solidification on all-d-metal NiCoMnTi based giant magnetocaloric Heusler compounds

Biocompatible optical physically unclonable function hydrogel microparticles for on-dose authentication

Effect of microporous layer structural parameters on heat and mass transfer in proton exchange membrane fuel cells

Assessing Angular Momentum, Kinetics, and Energetics of a Rigid Body Using a Single Inertial Measurement Unit

Measuring residual stresses in individual on-chip interconnects using synchrotron nanodiffraction

A critical assessment and summary on the low carbon energy pile technologies based on the life-cycle perspective: Challenges and prospects

Investigation of the first quasi-rectangular metro tunnel constructed by the 0−θ method

FedViT: Federated continual learning of vision transformer at edge

Vanadium-Containing Chloroperoxidase-Catalyzed Versatile Valorization of Phenols and Phenolic Acids

Junction temperature and luminous flux prediction for white LED array based on electrical-photo-thermal modeling

Machine learning assisted discovery of high-efficiency self-healing epoxy coating for corrosion protection

A study on siting of emergency shelters for dam failure floods considering population distribution and weather effects

Milliarcsecond-scale radio structure of the most distant BL Lac object candidate at redshift 6.57

Synchronized optimization of wind farm start-stop and yaw control based on 3D wake model

Potential of BREEAM-C to support building circularity assessment: Insights from case study and expert interview

Unraveling the hydrogen sulfide aging mechanism on electrical-thermal–mechanical property degradation of sintered nanocopper interconnects used in power electronics packaging