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Inamdar, A.S. (author), van Soestbergen, Michiel (author), Mavinkurve, Amar (author), van Driel, W.D. (author), Zhang, Kouchi (author)
Moulding compounds used for encapsulating electronics typically occupy a large portion of package volume and are most exposed to the external environment. Under harsh conditions such as high temperature, humidity, and mechanical vibrations, constituent materials of electronic components degrade, resulting in a change in their thermal, mechanical...
conference paper 2023
document
Broere, W. (author), Zhang, X. (author)
Daily and seasonal deformation behavior of immersed tunnels potentially impacts the structural integrity. In this study, distributed optical fiber sensors (DOFS) are used to instrument both dilation and immersion joints of the Heinenoordtunnel, an immersed tunnel in the Netherlands. This DOFS system proves capable of measuring joint opening and...
conference paper 2023
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Zhang, D. (author), Verschuur, D.J. (author)
Seismic data interpolation is a topic well suited for deep learning (DL) applications. Scaling operation-based DL neural networks, e.g., U-Net, have been popular since its booming development in the field of seismic data processing. Although many successful studies using U-Net on seismic data, scientists start to realize the downside of its...
conference paper 2023
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Kavoura, Dr. Florentia (author), Zhang, Y. (author), Veljkovic, M. (author)
The building sector is actively researching and reviewing technical solutions for de-construction, driven by the increasing importance of sustainability requirements, as outlined in the EU Commission's ‘Green Deal,‘ which aims to achieve net-zero greenhouse gas emissions by 2050. Two key research areas in efficient structural design strategies...
conference paper 2023
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Zhang, Feiran (author), Broz, F. (author), Ferrari, Oriana (author), Barakova, Emilia (author)
There is a growing interest in implementing robotics applications for children in healthcare to provide companionship, comfort, education, and therapy. Parental expectations regarding robotics for young children play a critical role in influencing its development and acceptance. However, parental expectations are widely overlooked in HRI....
conference paper 2023
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Rutten, J. (author), Tissier, M.F.S. (author), Zhang, Xinyi (author), Reniers, A.J.H.M. (author), van Wiechen, P.P.J. (author), de Vries, S. (author), Rijnsdorp, D.P. (author), Mol, Jan Willem (author), Wilmink, Rinse (author)
Infragravity (IG) waves are key drivers for coastal erosion and thus need to be properly included in process-based modelling of coastal hazards. Uncertainties remain regarding the offshore boundary conditions for these long waves. Typically, only bound IG waves are included at the boundary, which means that the possible contribution of free IG...
conference paper 2023
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Yuan, S. (author), Zhang, Z. (author), Fieback, M. (author), Xun, H. (author), Marinissen, E. J. (author), Kar, G. S. (author), Rao, S. (author), Couet, S. (author), Taouil, M. (author), Hamdioui, S. (author)
The development of Spin-Transfer Torque Magnetic RAMs (STT-MRAMs) mass production requires high-quality test solutions. Accurate and appropriate fault modeling is crucial for the realization of such solutions. This paper targets fault modeling and test generation for all interconnect and contact defects in STT-MRAMs and shows that using the...
conference paper 2023
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Zhang, Yu (author), Wang, Yue (author), Tian, Zhi (author), Leus, G.J.T. (author), Zhang, Gong (author)
This paper proposes a super-resolution harmonic retrieval method for uncorrelated strictly non-circular signals, whose covariance and pseudo-covariance present Toeplitz and Hankel structures, respectively. Accordingly, the augmented covariance matrix constructed by the covariance and pseudo-covariance matrices is not only low rank but also...
conference paper 2023
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Yazdan Mehr, M. (author), Hajipour, Pejman (author), van Zeijl, H.W. (author), van Driel, W.D. (author), Cooremans, Thierry (author), De Buyl, Francois (author), Zhang, Kouchi (author)
Adhesive bonding is a key joining technology in many industrial applications, including automotive, aerospace industries, biomedical devices, and microelectronic components. Adhesive bonding is gaining more and more attention due to the increasing demand for joining similar or dissimilar components, mostly within the framework of designing...
conference paper 2023
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Chen, Minggang (author), Zhang, H. (author), Fan, Q. (author)
Silicon MOSFETs-based medium-power (< 50W) Class-D amplifiers (CDAs) switching in the MHz range have gained popularity in recent years, which achieves better linearity thanks to a higher loop gain in the audio band while enabling the use of LC filters with higher cut-off frequencies. However, for high-power (>100 W) CDAs, such switching...
conference paper 2023
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Zhang, Y. (author), Mo, J. (author), Cui, Z. (author), Vollebregt, S. (author), Zhang, Kouchi (author)
The continuous downscaling of microelectronics has introduced many reliability issues on interconnect. Electromigration and dewetting are major reliability concerns in high-temperature micro- and nanoscale devices. In this paper, the local dewetting of copper thin film during the electromigration test was first found and investigated. When...
conference paper 2023
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Xun, H. (author), Fieback, M. (author), Yuan, S. (author), Zhang, Ziwei (author), Taouil, M. (author), Hamdioui, S. (author)
Resistive Random Access Memory (RRAM) is a potential technology to replace conventional memories by providing low power consumption and high-density storage. As various manufacturing vendors make significant efforts to push it to high-volume production and commercialization, high-quality and efficient test solutions are of great importance. This...
conference paper 2023
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Qu, Yiting (author), He, Xinlei (author), Pierson, Shannon (author), Backes, Michael (author), Zhang, Y. (author), Zannettou, S. (author)
The dissemination of hateful memes online has adverse effects on social media platforms and the real world. Detecting hateful memes is challenging, one of the reasons being the evolutionary nature of memes; new hateful memes can emerge by fusing hateful connotations with other cultural ideas or symbols. In this paper, we propose a framework that...
conference paper 2023
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Luopan, Yaxin (author), Han, Rui (author), Zhang, Qinglong (author), Liu, Chi Harold (author), Wang, Guoren (author), Chen, Lydia Y. (author)
Deep Neural Networks (DNNs) have been ubiquitously adopted in internet of things and are becoming an integral of our daily life. When tackling the evolving learning tasks in real world, such as classifying different types of objects, DNNs face the challenge to continually retrain themselves according to the tasks on different edge devices....
conference paper 2023
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Karmakar, S. (author), Zhang, H. (author), Berkhout, Marco (author), Fan, Q. (author)
This paper presents a Class-D piezoelectric speaker driver that employs a quadrature feedback chopping scheme (QCS). Compared to a conventional single feedback chopping scheme (SCS), the use of QCS can eliminate the timing skew between low-voltage (LV) and high-voltage (HV) choppers, greatly improving large-signal linearity. A prototype...
conference paper 2023
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van der Werf, V. (author), Zhang, Min Yi (author), Aivaloglou, E.A. (author), Hermans, Felienne (author), Specht, M.M. (author)
Motivation. Many people interested in learning a programming language choose online courses to develop their skills. The concept of variables is one of the most foundational ones to learn, but can be hard to grasp for novices. Variables are researched, but to our knowledge, few empirical observations on how the concept is taught in practice...
conference paper 2023
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Sattari, R. (author), van Zeijl, H.W. (author), Zhang, Kouchi (author)
Wide bandgap (WBG) semiconductor technologies enable significant progress in the emergence of power modules. Power cycling at elevated temperatures causes crack or delamination failure, especially at the die-attached bonded interface in the long term. Therefore, the in-situ reliability investigation of power modules, materials, and...
conference paper 2023
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Cui, Z. (author), Fan, X. (author), Zhang, Kouchi (author)
In this paper, we apply the Eshelby's solution to study the effect of passivation layer on electromigration (EM) failure in a conductor. The passivation layer is considered as an elastic material, not a rigid layer anymore. Thus, the deformation and stress evolution in the conductor during EM are related to the mechanical property of the...
conference paper 2023
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Martin, H.A. (author), Reintjes, Marcia (author), Reijs, Dave (author), Dorrestein, Sander (author), Kengen, Martien (author), Libon, Sebastien (author), Smits, Edsger (author), Tang, Xiao (author), Koelink, Marco (author), Poelma, René H. (author), van Driel, W.D. (author), Zhang, Kouchi (author)
Integrated Circuits and Electronic Modules experience concentrated thermal hot spots, which require advanced thermal solutions for effective distribution and dissipation of heat. The superior thermal properties of diamonds are long known, and it is an ideal material for heat-spreading applications. However, growing diamond films to the...
conference paper 2023
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Thukral, V. (author), Bacquet, Irene (author), Van Soestbergen, Michiel (author), Zaal, Jeroen (author), Roucou, Romuald (author), Rongen, Rene (author), van Driel, W.D. (author), Zhang, Kouchi (author)
Board level vibration testing is a commonly used method to predict the solder joint reliability of surface-mounted components seated onto printed circuit boards (PCB). Current board level vibration test methods are mainly developed from a solely mechanical stress application standpoint. This makes such stress tests one dimensional in nature...
conference paper 2023
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