Investigation on Transient Failure Mode of Asymmetric Trench Gate SiC MOSFET Under Single-Pulse Avalanche Stress

Screen Perturbation: Adversarial Attack and Defense on Under-Screen Camera

A hazard-based duration model to quantify the impact of work related distraction on taxi drivers’ safety performance: A driving simulator study

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Degradation of alkali-activated slag subjected to water immersion

Reverse Recovery Optimization of Multiepi Superjunction MOSFET Based on Tunable Doping Profile

Stretchable strain sensor based on HfSe₂/LIG composite with high sensitivity and good linearity within a wide range

Autogenous shrinkage of alkali-activated slag: A critical review

Comprehensive study on the degradation progress of crumb tire rubber during the preparation of terminal blended rubberized asphalt binder

Laser-Induced Graphene Formation on Chitosan Derivatives toward Ecofriendly Electronics

Rapid Fabrication of High-Performance Flexible Pressure Sensors Using Laser Pyrolysis Direct Writing

Sustainable Assessment Tools for Higher Education Institutions: Developing Two-Hierarchy Tools for China

A non-unit line protection method for MMC-HVDC grids based on the curvatures of backward traveling waves

Roles of waste carbon fibers on the efficiency of multiple induction heating healing behavior in asphalt mixture for sustainable infrastructure

When VLC Meets Under-Screen Camera

Reactivity and leaching potential of municipal solid waste incineration (MSWI) bottom ash as supplementary cementitious material and precursor for alkali-activated materials

Simplex-based multinomial logistic regression with diverging numbers of categories and covariate

A state-of-art review on development and progress of backfill grouting materials for shield tunneling

Deep Learning in Maritime Autonomous Surface Ships: Current Development and Challenges

Relationship between the migration of crustal material, normal faulting, and gneiss domes in the vicinity of the Dinggye region, central part of the Tethys–Himalaya terrane: Insights from the 3-D electrical structure