Molecular dynamics simulations on mechanical behaviors of sintered nanocopper in power electronics packaging

Unraveling the hydrogen sulfide aging mechanism on electrical-thermal–mechanical property degradation of sintered nanocopper interconnects used in power electronics packaging

Microscopic fracture toughness of notched porous sintered Cu micro-cantilevers for power electronics packaging

A Q-learning based multi-strategy integrated artificial bee colony algorithm with application in unmanned vehicle path planning

Insights into sulfur and hydrogen sulfide induced corrosion of sintered nanocopper paste: A combined experimental and ab initio study

Investigating the Sintering Process and Mechanical Properties of Nano-copper Particles Coupling Particle Packing Modeling with Molecular Dynamics Simulation

Warpage deformation analysis of AMB ceramic substrates in power modules

High temperature viscoplastic deformation behavior of sintered nanocopper paste used in power electronics packaging: Insights from constitutive and multi-scale modelling

Copper Nanoparticle Sintering Enabled Hermetic Packaging With Fine Sealing Ring for MEMS Application

Hydrolysis Mechanism Analysis of (Ca, Sr)AlSiN₃:Eu²⁺ Red Phosphor Aged Under Pressure Cooker Test and 85°C&85%RH Test: Kinetics Modeling and First-principles Calculation

Study on Sintering Mechanism and Mechanical Properties of Nano-Cu based on Molecular Dynamics Simulation

Nanoindentation characterization of sintered porous Cu nanoparticles used in power electronics packaging – A molecular dynamic simulation study

Effects of temperature and grain size on diffusivity of aluminium: electromigration experiment and molecular dynamic simulation

High-temperature nanoindentation characterization of sintered nano-copper particles used in high power electronics packaging

Insights into the high-sulphur aging of sintered silver nanoparticles: An experimental and ReaxFF study

Interactions between a magnon mode and a cavity photon mode mediated by traveling photons

Thermal kinetic and mechanical behaviors of pressure-assisted Cu nanoparticles sintering: A molecular dynamics study