Thermomechanical Oriented Reliability Enhancement of Si MOSFET Panel-Level Packaging Fusing Ant Colony Optimization With Backpropagation Neural Network

Considerable advancements in power semiconductor devices have resulted in such devices being increasingly adopted in applications of energy generation, conversion, and transmission. Hence, we proposed a fan-out panel-level packaging (FOPLP) design for 30-V Si-based metal-oxide-semiconductor field-effect transistor (MOSFET). To achieve...

Partial Discharge Behavior of Typical Defects in Power Equipment under Multilevel Staircase Voltage

With the widespread application of power electronic switching technology, power equipment is facing new electrical stresses brought about by multilevel staircase voltages during testing and operation. Therefore, the partial discharge (PD) behavior of five typical defects in power equipment under the staircase waveform needs to be investigated...

Investigation of drying-induced non-uniform deformation, stress, and micro-crack propagation in concrete

Concrete generally deforms and cracks in a non-uniform manner under drying-induced stress. This study used the lattice fracture model to simulate the drying-induced non-uniform deformations, stresses, and micro-crack propagation in concrete. Experiments were designed to validate the lattice fracture model, wherein the drying-induced non...