Post-buckling behavior and collapse of Double-Double composite single stringer specimens

Dataset on the tested and simulated response of thick cold-formed circular hollow sections under cyclic loading

Uncertainty quantification of the wall thickness and stiffness in an idealized dissected aorta

Multi Physics Simulation of Wafer Bonding with Nano Copper Paste

Warpage deformation analysis of AMB ceramic substrates in power modules

FE-assisted investigation for mechanical behaviour of connections in offshore wind turbine towers

Progressive failure mechanisms of geosynthetic-reinforced column-supported embankments over soft soil: Numerical analyses considering the cracks-induced softening

3D printed patient-specific fixation plates for the treatment of slipped capital femoral epiphysis: Topology optimization vs. conventional design

A bending-active gridshell as falsework and integrated reinforcement for a ribbed concrete shell with textile shuttering: Design, engineering, and construction of KnitNervi

Improved Winding Losses Calculation based on Bessel Functions

Skin-stringer separation in post-buckling of butt-joint stiffened thermoplastic composite panels

A criterion for predicting delamination growth in composite laminates

Toward identifying the ASR-induced stresses from displacement measurements and crack observations—Demonstration on a beam bridge in Norway

Combined stent-retriever and aspiration intra-arterial thrombectomy performance for fragmentable blood clots: A proof-of-concept computational study

Combined DIC and FEA method for analysing debonding crack propagation in fatigue experiments on wrapped composite joints

Shape-memory polymer metamaterials based on triply periodic minimal surfaces

Combined effects of stress and temperature on hydrogen diffusion in non-hydride forming alloys applied in gas turbines

Characterization and analysis of the interlaminar behavior of thermoplastic composites considering fiber bridging and R-curve effects

Finite element modeling and analysis of ultrasonic bonding process of thick aluminum wires for power electronic packaging

Effect of imperfections on the actuation performance of lattice materials