Behavior of Engineered Cementitious Composites (ECCs) Subjected to Coupled Sustained Flexural Load and Salt Frost

A Secure Robot Learning Framework for Cyber Attack Scheduling and Countermeasure

Polynomial Chaos Expansion-Based Enhanced Gaussian Process Regression for Wind Velocity Field Estimation from Aircraft-Derived Data

Interpretation of the early stiffening process in alkali-activated slag pastes

Tailoring the flow properties of inhaled micronized drug powders by atomic and molecular layer deposition

Codon-specific KRAS mutations predict survival benefit of trifluridine/tipiracil in metastatic colorectal cancer

Silicon carbide-on-insulator thermal-piezoresistive resonator for harsh environment application

Amalur: Data Integration Meets Machine Learning

Fast Loss of Effectiveness Detection on a Quadrotor using Onboard Sensors and a Kalman Estimation Approach

An Empirical Performance Comparison between Matrix Multiplication Join and Hash Join on GPUs

Increasing arsenic immobilization capacity of a binder prepared by arsenic-containing biohydrometallurgy waste: Effects of ferric/ferrous salts addition

Mechanical and shape memory properties of NiTi triply periodic minimal surface structures fabricated by laser powder bed fusion

DaisyRec 2.0: Benchmarking Recommendation for Rigorous Evaluation

Designed Multifunctional Spider Silk Enabled by Genetically Encoded Click Chemistry

Scenario-based performance assessment of green-grey-blue infrastructure for flood-resilient spatial solution: A case study of Pazhou, Guangzhou, greater Bay area

Immobilization capacity assessment of a binder from arsenic-containing biohydrometallurgy waste: Effects of halloysite nanotubes and biochar addition

Investigation on the effect of interface properties on compressive failure behavior of 3D woven composites through micromechanics-based multiscale damage model

A micro graphene high temperature sensor with a single Si₃N₄ protective layer

Effect of white mud on properties of alkali activated slag

High temperature viscoplastic deformation behavior of sintered nanocopper paste used in power electronics packaging: Insights from constitutive and multi-scale modelling