- Thermomechanical Oriented Reliability Enhancement of Si MOSFET Panel-Level Packaging Fusing Ant Colony Optimization With Backpropagation Neural Network
- Genetic Algorithm–Assisted Design of Redistribution Layer Vias for a Fan-Out Panel-Level SiC MOSFET Power Module Packaging
- Effect of coarse aggregate size on non-uniform stress/strain and drying-induced microcracking in concrete
- Green Approach for Post-industrial Urban Regeneration: A case of Economic and Technical Development Zone, China
- Investigation of drying-induced non-uniform deformation, stress, and micro-crack propagation in concrete
- Effect of relative humidity on drying-induced damage in concrete: A comparative study of digital image correlation and lattice modelling
- Reliability Assessment of Light-Emitting Diode Packages with Both Luminous Flux Response Surface Model and Spectral Power Distribution Method