Multi Physics Simulation of Wafer Bonding with Nano Copper Paste

The significance of wafer bonding is fundamental to the progression of electronic systems. Common fabrication techniques for Cu pillars play a crucial role in establishing resilient and efficient interconnects within semiconductor devices. It is imperative to explore the potential of nano-copper as an alternative material to overcome limitations...

The Multimodal Information Based Speech Processing (Misp) 2022 Challenge: Audio-Visual Diarization And Recognition

The Multi-modal Information based Speech Processing (MISP) challenge aims to extend the application of signal processing technology in specific scenarios by promoting the research into wake-up words, speaker diarization, speech recognition, and other technologies. The MISP2022 challenge has two tracks: 1) audio-visual speaker diarization (AVSD),...

Graph Convolution-Based Deep Reinforcement Learning for Multi-Agent Decision-Making in Interactive Traffic Scenarios

A reliable multi-agent decision-making system is highly demanded for safe and efficient operations of connected and autonomous vehicles (CAVs). In order to represent the mutual effects between vehicles and model the dynamic traffic environments, this research proposes an integrated and open-source framework to realize different Graph...

Bonding Process of Copper Foam-Silver Composite and Performance Characterization of the Joint

As a key heat-dissipating and electrical interconnecting component in high-temperature power modules, die-attach and substrate-attach layers play an important role in effectively reducing the thermal resistance and improving the long-term reliability. Traditional substrate-attach materials limit the high-temperature applications of packaging...

Form-finding and construction of ice composite shell structures

By using inflatable moulds and then spraying cellulose-water mixture, one ice dome and two ice towers were built in Harbin in December 2016. During the whole process, form-finding of the inflatable moulds as well as the construction of these ice composite shell structures are very important for the final results.<br/>The mould for the ice dome...

A CMOS 128-APS linear array integrated with a LVOF for highsensitivity and high-resolution micro-spectrophotometry

A linear array of 128 Active Pixel Sensors has been developed in standard CMOS technology and a Linear Variable Optical Filter (LVOF) is added using CMOS-compatible post-process, resulting in a single chip highly-integrated highresolution microspectrometer. The optical requirements imposed by the LVOF result in photodetectors with small pitch...