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Chen, Xianping (author), Ye, H. (author), Fan, Xuejun (author), Ren, Tianling (author), Zhang, Kouchi (author)
Heat pipes (HPs) have received considerable attention in recent decades, especially in the field of cooling electronics, which requires the removal of added heat from an area of limited volume to the environment. Small HPs are widely used in electronic applications, which are normally limited by the compact structure and dimensions of the...
journal article 2016
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Ye, H. (author), Leung, Stanley Y.Y. (author), Wong, K.Y. (author), Chen, Xianping (author), Lin, Kai (author), Fan, J. (author), Kjelstrup, Signe (author), Fan, Xuejun (author), Zhang, Kouchi (author)
Using the analogue of the electric inductance, we reveal the properties of the thermal inductance in GaN-based light-emitting diode devices by testing their transient thermal behaviors. We find that the devices exhibit a transient thermal response under step-down or step-up currents and observe notable inductive phenomena of the temperature...
journal article 2016
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Tang, H. (author), Ye, H. (author), Wong, K.Y. (author), Leung, Stanley Y.Y. (author), Fan, Jiajie (author), Chen, Xianping (author), Fan, Xuejun (author), Zhang, Kouchi (author)
The objective of this study is to quantitatively evaluate the impacts of LED components on the overdriving reliability of high power white LED chip scale packages (CSPs). The reliability tests under room temperature are conducted over 1000 h in this study on CSP LEDs with overdriving currents. A novel method is proposed to investigate the...
journal article 2017
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Chen, Liangbiao (author), Zhou, Jiang (author), Chu, Hsing-wei (author), Zhang, Kouchi (author), Fan, Xuejun (author)
While moisture diffusion in microelectronic device and packaging has been studied for decades, the problems involving complex nonlinear moisture diffusion in multi-material assembly have not been fully studied. This paper has developed a general nonlinear diffusion model by adopting water activity, a continuous state variable, as the field...
journal article 2017
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Tang, H. (author), Ye, Huai-Yu (author), Chen, Xian-Ping (author), Qian, Cheng (author), Fan, Xue-Jun (author), Zhang, Kouchi (author)
In this paper, the heat transfer performance of the multi-chip (MC) LED module is investigated numerically by using a general analytical solution. The configuration of the module is optimized with genetic algorithm (GA) combined with a response surface methodology. The space between chips, the thickness of the metal core printed circuit board...
journal article 2017
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Yang, Ning (author), Yang, Daoguo (author), Zhang, Kouchi (author), Chen, Liangbiao (author), Liu, Dongjing (author), Cai, Miao (author), Fan, Xuejun (author)
The effects of graphene stacking are investigated by comparing the results of methane adsorption energy, electronic performance, and the doping feasibility of five dopants (i.e., B, N, Al, Si, and P) via first-principles theory. Both zigzag and armchair graphenes are considered. It is found that the zigzag graphene with Bernal stacking has...
journal article 2018
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Cui, Z. (author), Chen, Xianping (author), Fan, Xuejun (author), Zhang, Kouchi (author)
Interfacial properties of Cu/SiO2 in semiconductor devices has continued to be the subject of challenging study for many years because of its difficulties in experimentally quantifying the critical strength of interface. In this paper, a multi-scale modeling approach is built to characterize the interfacial properties between Cu and SiO2. In...
conference paper 2018
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Chen, Wei (author), Fan, J. (author), Qian, Cheng (author), Pu, Bin (author), Fan, Xuejun (author), Zhang, Kouchi (author)
The inherent luminous characteristics and stability of LED packages during the operation period are highly dependent on their junction temperatures and driving currents. In this paper, the luminous flux of LED packages operated under a wide range of driving currents and junction temperatures are investigated to develop a luminous flux...
journal article 2019
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Fan, Guangpeng (author), Nan, L. (author), Dong, Yanqi (author), Su, Xiaohui (author), Chen, Feixiang (author)
Forest above-ground biomass (AGB) can be estimated based on light detection and ranging (LiDAR) point clouds. This paper introduces an accurate and detailed quantitative structure model (AdQSM), which can estimate the AGB of large tropical trees. AdQSM is based on the reconstruction of 3D tree models from terrestrial laser scanning (TLS) point...
journal article 2020
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Fan, Guangpeng (author), Nan, L. (author), Chen, Feixiang (author), Dong, Yanqi (author), Wang, Zhiming (author), Li, Hao (author), Chen, Danyu (author)
Tree-level information can be estimated based on light detection and ranging (LiDAR) point clouds. We propose to develop a quantitative structural model based on terrestrial laser scanning (TLS) point clouds to automatically and accurately estimate tree attributes and to detect real trees for the first time. This model is suitable for forest...
journal article 2020
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Fan, J. (author), Chen, Wei (author), Yuan, Weiyi (author), Fan, X. (author), Zhang, Kouchi (author)
Light-emitting diode (LED) arrays have attracted increased attention in the area of high power intelligent automotive headlamps because of their superiority in disposing of the power limit of an individual LED package and controllably luminous intensity and illumination pattern. The optical and chromatic performances of an LED array do not...
journal article 2020
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Cao, Yixing (author), Chen, Shanghuan (author), Li, Yutong (author), Du, Yunjia (author), Chen, Wei (author), Fan, J. (author), Zhang, Kouchi (author)
The emission spectra of high color rendering phosphors, mixed with the yttrium aluminium garnet, silicon based oxynitride and nitride based phosphors, were predicted by the Lambert-Beer theory and back propagation neural network (BP NN). Firstly, the modified Lambert-Beer model was used to calculate the proportional coefficient of the...
journal article 2021
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Huang, Xinxing (author), Li, Yifan (author), Tian, Zhan (author), Ye, Qinghua (author), Ke, Q. (author), Fan, Dongli (author), Mao, Ganquan (author), Chen, Aifang (author), Liu, Junguo (author)
Efficient and accurate streamflow predictions are important for urban water management. Data-driven models, especially neural network (NN) models can predict streamflow fast, while the results are uncertain in some complex river systems. Physically based models can reveal the underlying physics, but it is relatively slow and computationally...
journal article 2021
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Jiang, Peng (author), Fu, Xiuju (author), Fan, Yee Van (author), Klemeš, Jiří Jaromír (author), Chen, P. (author), Ma, Stefan (author), Zhang, Wanbing (author)
Coronavirus disease-2019 (COVID-19) poses a significant threat to the population and urban sustainability worldwide. The surge mitigation is complicated and associates many factors, including the pandemic status, policy, socioeconomics and resident behaviours. Modelling and analytics with spatial-temporal big urban data are required to assist...
journal article 2021
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Chen, Wei (author), Chen, Ye (author), Cao, Yixing (author), Cui, Z. (author), Fan, Xuejun (author), Zhang, Kouchi (author), Fan, J. (author)
In a light-emitting diode (LED) package, silicone encapsulant serves as a chip protector and enables the light to transmit, since it exhibits the advantages of high light transmittance, high refractive index, and high thermal stability. However, its reliability is still challenged under harsh operation conditions. In this study, the optical...
journal article 2022
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Fan, Jiajie (author), Qian, Yichen (author), Chen, Wei (author), Jiang, Jing (author), Tang, Zhuorui (author), Fan, Xuejun (author), Zhang, Kouchi (author)
A fan-out panel-level packaging (FOPLP) with an embedded redistribution layer (RDL) via interconnection reduces the size, thermal resistance, and parasitic inductance of power module packaging. In this study, the effect of the RDL via size on the reliability of a FOPLP SiC MOSFET power module was investigated. To improve the thermal management...
conference paper 2022
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Fan, Guangpeng (author), Xu, Zhenyu (author), Wang, Jinhu (author), Nan, L. (author), Xiao, Huijie (author), Xin, Zhiming (author), Chen, Feixiang (author)
Complexity of forest structure is an important factor contributing to uncertainty in aboveground biomass estimates. In this study, we present a new method for reducing uncertainty in forest aboveground biomass (AGB) estimation based on plot-level terrestrial laser scanner (TLS) point clouds reconstruction. The method estimates the total AGB...
journal article 2022
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Feng, Shuo (author), Jiang, Tao (author), Chen, Wei (author), Fan, Xuejun (author), Zhang, Kouchi (author), Fan, Jiajie (author)
As a core packaging material of light color conversion, phosphor/silicone composite plays an indispensable role in light emitting diode (LED) packaging. At present, commercial LED packages mainly use blue LED chips to stimulate Yttrium Aluminum Garnet (YAG) yellow phosphor to reach a white color. However, (Ca,Sr)AlSiN 3 :Eu 2+ (CSASN) red...
conference paper 2022
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Cao, Yixing (author), Chen, Wei (author), Du, Yunjia (author), Qi, Gaojin (author), Santos, Thebano (author), Zhang, Kouchi (author), Fan, J. (author)
YAG: Ce3+ phosphor/silicone composites are widely used in solid-state lighting as a light converter to achieve white lighting. However, because of high thermal resistance and low thermal stability, the luminous performance of YAG: Ce3+ phosphor/silicone composite deteriorates rapidly when excited by high-power-density blue-laser. To explore...
journal article 2022
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Jiang, Jing (author), Chen, Wei (author), Qian, Yichen (author), Meda, Abdulmelik H. (author), Fan, X. (author), Zhang, Kouchi (author), Fan, J. (author)
Considerable advancements in power semiconductor devices have resulted in such devices being increasingly adopted in applications of energy generation, conversion, and transmission. Hence, we proposed a fan-out panel-level packaging (FOPLP) design for 30-V Si-based metal-oxide-semiconductor field-effect transistor (MOSFET). To achieve...
journal article 2023
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