Thermomechanical Oriented Reliability Enhancement of Si MOSFET Panel-Level Packaging Fusing Ant Colony Optimization With Backpropagation Neural Network

Considerable advancements in power semiconductor devices have resulted in such devices being increasingly adopted in applications of energy generation, conversion, and transmission. Hence, we proposed a fan-out panel-level packaging (FOPLP) design for 30-V Si-based metal-oxide-semiconductor field-effect transistor (MOSFET). To achieve...

Genetic Algorithm–Assisted Design of Redistribution Layer Vias for a Fan-Out Panel-Level SiC MOSFET Power Module Packaging

A fan-out panel-level packaging (FOPLP) with an embedded redistribution layer (RDL) via interconnection reduces the size, thermal resistance, and parasitic inductance of power module packaging. In this study, the effect of the RDL via size on the reliability of a FOPLP SiC MOSFET power module was investigated. To improve the thermal management...

Numerical investigation of the flow field and mass transfer characteristics in a jet slurry pump

A jet pump is used to transport a variety of working media and is especially suitable for dredged soil transporting. In this study, a three-dimensional numerical study of a jet pump that is used for slurry delivery was carried out. The characteristics of the internal flow field of the mixing chamber with different working parameters were...

Effect of coarse aggregate size on non-uniform stress/strain and drying-induced microcracking in concrete

Non-uniform stresses, strains and microcracking of the concretes with three coarse aggregate sizes (5–10 mm, 10–16 mm, 16–20 mm) dried under 40% relative humidity (RH) for 60 days were quantified using digital image correlation and lattice fracture modelling. The influencing mechanism of coarse aggregate size on the drying-induced...

Green Approach for Post-industrial Urban Regeneration: A case of Economic and Technical Development Zone, China

For cities facing post-industrial transition, urban greenways are proven strategies to activate urban spaces and improve the sustainability of cities. However, significant challenges remain when seeking to link greenways as a greenway network and integrate greenway networks to urban spaces. Given this shortcoming, Yantai National Economic and...

Investigation of drying-induced non-uniform deformation, stress, and micro-crack propagation in concrete

Concrete generally deforms and cracks in a non-uniform manner under drying-induced stress. This study used the lattice fracture model to simulate the drying-induced non-uniform deformations, stresses, and micro-crack propagation in concrete. Experiments were designed to validate the lattice fracture model, wherein the drying-induced non...

Effect of relative humidity on drying-induced damage in concrete: A comparative study of digital image correlation and lattice modelling

To assess the effect of relative humidity (RH) on drying-induced damage in concrete, the non-uniform strains and microcracks in concrete under different RH conditions were obtained using the digital image correlation (DIC) technique and lattice fracture model. The simulated non-uniform displacements were consistent with those captured using...

Reliability Assessment of Light-Emitting Diode Packages with Both Luminous Flux Response Surface Model and Spectral Power Distribution Method

The inherent luminous characteristics and stability of LED packages during the operation period are highly dependent on their junction temperatures and driving currents. In this paper, the luminous flux of LED packages operated under a wide range of driving currents and junction temperatures are investigated to develop a luminous flux...

Numerical thermal analysis and optimization of multi-chip LED module using response surface methodology and genetic algorithm

In this paper, the heat transfer performance of the multi-chip (MC) LED module is investigated numerically by using a general analytical solution. The configuration of the module is optimized with genetic algorithm (GA) combined with a response surface methodology. The space between chips, the thickness of the metal core printed circuit board...

State-of-art of asphalt surfacings on long-spanned orthotropic steel deck in China

Reliable and durable asphalt surfacing systems still remain to be desired for the long-spanned orthotropic steel bridges as the nationally and internationally reports on distresses in deck pavement. Based on ten-year research works, this paper has presented a brief review and discussion of the Chinese practices and experiences of deck pavement...