Integrated Circuits for Miniature 3–D Ultrasound Probes: Solutions for the Interconnection Bottleneck

This thesis describes low-power application-specific integrated circuit (ASIC) designs to mitigate the constraint of cable count in miniature 3-D TEE probes. Receive cable count reduction techniques including subarray beamforming and digital time-division multiplexing (TDM) have been explored and the effectiveness of these techniques has been...

Front-End ASICs for 3-D Ultrasound: From Beamforming to Digitization

This thesis describes the analysis, design and evaluation of front-end application-specific integrated circuits (ASICs) for 3-D medical ultrasound imaging, with the focus on the receive electronics. They are specifically designed for next-generation miniature 3-D ultrasound devices, such as transesophageal echocardiography (TEE), intracardiac...