Fracture and Failure of Adhesives

This article presents an overview of methods for analyzing the facture and failure of adhesives. Special attention is given to stress analysis in adhesive bonds, as the difficulty of performing an accurate stress analysis is a major limitation of many failure analysis methods. The article also covers the effect of manufacturing and...

The effect of bond-line thickness on fatigue crack growth rate in adhesively bonded joints

The effect of adhesive thickness on fatigue crack growth in an epoxy film adhesive (FM94) was investigated, using a combination of experiments and numerical modelling. For the range of thicknesses investigated an increased thickness led to an increased crack growth rate. It was found that the energy required per unit of crack growth did not...

Using acoustic emission to understand fatigue crack growth within a single load cycle

Current methods for prediction of fatigue crack growth are based on empirical correlations which do not take the crack growth behaviour within a single cycle into account. To improve these prediction methods, more understanding of the physical mechanisms of crack growth is required. In this research the acoustic emission technique was used to...

The effect of temperature on fatigue crack growth in FM94 epoxy adhesive bonds investigated by means of energy dissipation

The effect of temperature on fatigue crack growth in epoxy adhesive bonds was investigated for a range of temperatures from -55 to 80[U+202F]°C. The fatigue crack growth behaviour was characterised using both strain energy release rate (SERR) and by measurements of energy dissipation. It was found that for a given maximum SERR, or a given...

Characterisation of Fatigue Crack Growth in Adhesive Bonds

On the physical interpretation of the R-ratio effect and the LEFM parameters used for fatigue crack growth in adhesive bonds

The available models for the prediction of fatigue crack growth in adhesive bonds rely on the similitude principle. In most cases, one of three similitude parameters based on the strain energy release rate (SERR) is used; i.e. G_max, (Δ√G)², or ΔG. In all cases it is usually observed that keeping the similitude parameter...

Characterising resistance to fatigue crack growth in adhesive bonds by measuring release of strain energy

Measurement of the energy dissipation during fatigue crack growth is used as a technique to gain more insight into the physics of the crack growth process. It is shown that the amount of energy dissipation required per unit of crack growth is determined by Gmax, whereas the total amount of energy available for crack growth in a single cycle is...

On the relationship between disbond growth and the release of strain energy

Current prediction methods for growth of disbonds under fatigue loading are generally based on a correlation with either the maximum strain energy release rate (SERR) or the SERR range. This paper highlights some issues with this approach. In particular, it is argued that the maximum SERR or the SERR range alone do not give sufficient...

Towards Understanding Fatigue Disbond Growth via Cyclic Strain Energy

The concept of relating fatigue disbond growth to the strain energy release rate (SERR) is critically examined. It is highlighted that the common practise of using only the maximum SERR or only the SERR range is insufficient to correctly characterize a load cycle. As crack growth requires energy, it is argued that growth should be related to the...