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Tang, Adrian (author), Alonso Del Pino, M. (author), Kim, Yanghyo (author), Zhang, Yan (author), Reck, Theodore (author), Jung-Kubiak, Cecile (author), Nemchick, Deacon (author), Dyer, Logan (author), Virbila, Gabriel (author), Chattopadhyay, Goutam (author), Chang, Mau Chung Frank (author)
This paper presents an overview of a sub-orbital flight demonstration with a 183 GHz and 540–600 GHz limb-sounding instrument aboard a stratospheric ballooncraft. The 183 GHz band provides soundings of stratospheric H 2 O and is implemented with a hybrid CMOS-InP receiver architecture which provides excellent sensitivity while remaining compact ...
journal article 2021
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Wörhoff, Kerstin (author), Prak, Albert (author), Postma, F. (author), Leinse, A (author), Wu, K. (author), Peters, T.J. (author), Tichem, M. (author), Amaning-Appiah, B. (author), Renukappa, V. (author), Vollrath, G. (author), Balcells-Ventura, J. (author), Uhlig, P. (author), Seyfried, M. (author), Rose, D. (author), Santos, Raquel (author), Leijtens, XJM (author), Flintham, B. (author), Wale, M. (author), Robbins, D. (author)
Fully automated, high precision, cost-effective assembly technology for photonic packages remains one of the main challenges in photonic component manufacturing. Next to the cost aspect the most demanding assembly task for multiport photonic integrated circuits (PICs) is the high-precision (±0.1 μm) alignment and fixing required for optical I...
conference paper 2016