A Thin-film Reconfigurable SiC Thermal Test Chip for Reliability Monitoring in Harsh Environments

Wide bandgap (WBG) semiconductor technologies enable significant progress in the emergence of power modules. Power cycling at elevated temperatures causes crack or delamination failure, especially at the die-attached bonded interface in the long term. Therefore, the in-situ reliability investigation of power modules, materials, and...

Finite Element Modeling for Thermal Conductivity of Cement-based Encapsulation Materials

With the trend of miniaturization and the increasing power density, the operating temperature of electronic devices keeps climbing, especially for wide band-gap semiconductors such as silicon carbide and gallium nitride. The high operating temperature up to 250℃ brings challenges to encapsulation materials since traditional encapsulation...

Electromagnetic Marchenko imaging in 1D for dissipative media

We present a one-dimensional lossless scheme to compute an image of a dissipative medium from two single-sided reflection responses. One reflection response is measured at or above the top reflector of a dissipative medium and the other reflection response is computed as if measured at or above the top reflector of a medium with negative...