Thermomechanical Oriented Reliability Enhancement of Si MOSFET Panel-Level Packaging Fusing Ant Colony Optimization With Backpropagation Neural Network

Considerable advancements in power semiconductor devices have resulted in such devices being increasingly adopted in applications of energy generation, conversion, and transmission. Hence, we proposed a fan-out panel-level packaging (FOPLP) design for 30-V Si-based metal-oxide-semiconductor field-effect transistor (MOSFET). To achieve...

基于分段步进式弹塑性格构模型的混凝土破坏过程细观模拟

The classically lattice model assumes the local elements behave elastic brittle, neglecting the ductility of the mortar matrix. This leads to the simulated load⁃displacement response more brittle than the realistic. To solve the aforementioned issue, a piece⁃wise approach was introduced to describe the elastic⁃plastic constitutive relation of...