Thermomechanical Oriented Reliability Enhancement of Si MOSFET Panel-Level Packaging Fusing Ant Colony Optimization With Backpropagation Neural Network

Considerable advancements in power semiconductor devices have resulted in such devices being increasingly adopted in applications of energy generation, conversion, and transmission. Hence, we proposed a fan-out panel-level packaging (FOPLP) design for 30-V Si-based metal-oxide-semiconductor field-effect transistor (MOSFET). To achieve...

Research on Thermal-Mechanical Properties of GaN Power Module Based on QFN Package by Using Nano Copper/Silver Sinter Paste

The wide-bandgap semiconductors represented by GaN have a broad application prospect because of their high service temperature and high switch frequency. Quad-Flat-No-Lead (QFN) Package is currently one of the mainstream packaging methods due to its low cost and high efficiency. However, the low reliability of QFN used in GaN devices is still...

Practical aspects of thermomechanical modeling in electronics packaging: A case study with a SiC power package

In this paper, we presented several practical aspects for building robust and reliable finite element models in thermomechanical modeling in electronics packaging using finite element analysis. Firstly, for layered or patterned structures, a homogenized equivalent model, with equivalent orthotropic material properties, gives excellent...

A new hermetic sealing method for ceramic package using nanosilver sintering technology

High reliable packaging materials are needed for electronics when they work at harsh environments. Among which, the nanosilver material has been widely studied and applied in power electronics due to its low processing temperature and high reliability. This paper investigates the bonding properties of nanosilver sintered hermetic cavity. There...

Photometric and colorimetric assessment of LED chip scale packages by using a step-stress accelerated degradation test (SSADT) method

By solving the problem of very long test time on reliability qualification for Light-emitting Diode (LED) products, the accelerated degradation test with a thermal overstress at a proper range is regarded as a promising and effective approach. For a comprehensive survey of the application of step-stress accelerated degradation test (SSADT) in...