As an outstanding corrosion inhibitor for copper, the adsorption behavior of benzotriazole on copper nano cluster has been investigated and compared with copper (111), (100) and (110) surfaces by means of density functional theory (DFT) calculations. Calculations reveal that benzotriazole has chemical adsorption on different copper surfaces and copper nano cluster when its N2-N3 bond is placed down on them. Also, the adsorption energy and closest interatomic distance show strong dependence on the surface structure, which indicates its ability to passivate the reactive under-coordinated surface sites. Relatively strong chemical bond between the copper cluster and the adsorbate is found to form. The chemisorption mechanism and the local structure of benzotriazole on copper surfaces and nano cluster are also discussed and presented.@en

Nano-metal sintering is a promising technology for the next generation of semiconductor packaging due to its positive effect on reliability enhancement. Compared with the silver sintering, copper-based sintering technique has more potential to be applied in die attachment field as its superiorities on lower cost, higher melting temperature without electromigration. In this study, Taguchi method is applied to study and analyze the effect of nano-/micro- particle ratio on sintering properties. Sintering temperature is also taken into account since it depends on the particle size a lot. The results show that both sintering temperature and nano-micro- ratio play significant role on influencing shear strength. The best combination is 300 nm with 1 um mixing (1:1) with over 35 MPa shear strength with 300°C sintering temperature. The fracture surface result shows that the crack propagated in the sintering body. Furthermore, the cross-section inspection reveals dense bonding and clearly sintering necking, and the porosity is lower than 12%. 227.8 W/m*K thermal conductivity and 6.0 uΩ·cm electrical resistivity are measured for the sample, which indicates the great potential for the packaging application in high power situation.@en