Ballast layer defects are the primary cause for rapid track geometry degradation. Detecting these defects in real-time during track inspections is urgently needed to ensure safe train operations. To achieve this, an indicator, the track degradation rate (TDR) was proposed. This rate is calculated using track geometry inspection data to locate and predict railway-line sections with ballast layer defects. The TDR is determined by the monthly standard deviation of the rail longitudinal level, which is one aspect of track geometry. The Ballast Layer Health Classification (BLHC) is designed by assessing the two successive TDRs before and after track geometry maintenance actions. The BLHC is used to categorize the conditions of the ballast layer, including normal periodic deterioration, abrupt deterioration, effective maintenance, rising deterioration, and severe deterioration. Both the TDR and BLHC were validated through field assessments of ballast layer conditions, where the two indicators were found to be effective in revealing defects. The results indicate that the TDR is sensitive to ballast layer defects, while the BLHC can quickly identify the location of these defects. Consequently, the BLHC can provide real-time guidance for ballast layer maintenance.

This paper studies two different approaches for evanescent wave optical sensing: an horizontal one and a vertical one. In horizontal waveguides, the evanescent wave is distributed on the upper cladding. While in a vertical configuration, the evanescent wave is distributed on the left and right sides of the waveguide. In an horizontal configuration the evanescent wave can be also on both sides of the waveguide in order to increase the optical energy for sensing if the substrate under the waveguide is locally removed. However, in this configuration to achieve sensitive devices, the layers have to be freestanding and thin [1] limiting practical implementations of such approaches. Furthermore, very few materials can be defined as tall and thin in the case of a vertical configuration, as the deposition techniques often used (PECVD/LPCVD) are meant for films in the couple of micron range. In the following we will investigate the properties of the materials used but also the fabrication feasibility for both configurations.