ME
Marius Enachescu
Authored
2 records found
Electrodeposited Sn-Cu-Ni alloys as lead-free solders on copper substrate using deep eutectic solvents
The influence of electrodeposition mode on the morphology, composition and corrosion behaviour
In this work we present the pulsed current (PC) electrodeposition of Sn-Cu-Ni alloy as lead-free solder candidate, from choline chloride – ethylene glycol eutectic mixtures (1:2 molar ratio) onto copper metallic substrates. Electrolytes containing Sn2+, Cu2+ and Ni2+ salts in the
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McCulloch-Pitts neuron structures are comprised of a number of synaptic inputs and a decision element, called soma. In this paper, we propose a 5-bit Graphene Nanoribbon (GNR)-based DAC to fulfill the role of the summation element featuring programmable input weights. The propose
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