TW
T. Wang
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2 records found
1
Interconnection mechanism and strengthening behavior of nano-silver sintered joints for silicon carbide power module packaging
A combined EBSD and nanoindentation study
Investigating the interconnection and strengthening mechanisms of die-attach layers is instrumental for advancing die attach process toward low-pressure and, ultimately, pressureless sintering while maintaining reliability. This study compares the microstructure and micromechanic
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Behaviour change in post-consumer recycling
Applying agent-based modelling in social experiment
Change in consumer behavior that leads to increased waste separation and recycling has been identified as a critical component of Chinese national strategy for constructing a “Circular Economy”. Various innovative solutions at community level targeting consumer behaviors are emer
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