P Raghavan
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4 records found
1
This paper presents an accurate technique to extensively analyze the impact of time-zero (i.e., global and local variation) and time-dependent (i.e., voltage, temperature, workload, and aging) variation on the offset voltage specification of a memory sense amplifier design using 45 nm predictive technology model (PTM) high performance library. The results show that increasing the supply voltage both for time-zero and time-dependent reduces the offset voltage specification marginally, irrespective of the process corners. In contrast, the offset voltage specification is very sensitive to the temperature and the workload, i.e., the applied voltage patterns. The results also show that a balanced workload results in a significantly lower offset voltage specification. The above results can be used to estimate the required offset voltage accurately for a given lifetime, and operational conditions such as workload, temperature, and voltage; hence, enable the designer to take appropriate measures for a high quality, robust, optimal and reliable design.
The CMOS technology scaling faced over the past recent decades severe variability and reliability challenges. One of the major reliability challenges is bias temperature instability (BTI). This paper analyzes the impact of BTI on the sensing delay of standard latch-type sense amplifier (SA), which is one of the critical components of high performance memories; the analysis is done by incorporating the impact of process, voltage, and temperature variations (in order to investigate the severity of the integral impact) and by considering different workloads and four technology nodes (i.e., 45, 32, 22, and 16 nm). The results show the importance of taking the SA degradation into consideration for robust memory design; the SA degradation depends on the application and technology node, and the sensing delay can increase with 184.58% for the worst case conditions at 16 nm. The results also show that the BTI impact for nominal conditions at 16 nm reaches a 12.10% delay increment. On top of that, when extrinsic conditions are considered, the degradation can reach up to 168.45% at 398 K for 16 nm.