Modelling dislocation glide over the initial part of a stress–strain curve of metals received little attention up to now. However, dislocation glide is essential to ones understanding of the fundamental relationship between inelastic deformation and the evolution of the dislocation network structure. Therefore, we present a model of dislocation-driven deformation under static loading conditions. We reproduce repeated cyclic uniaxial tensile tests on Interstitial-Free and Low-Alloy steels. The elastic mechanical behaviour is described by isotropic linear elasticity, pre-yield anelastic mechanical behaviour by a dislocation bow-out model with dissipation, and the post-yield evolution of dislocation network structure by a statistical storage model. We hypothesise that when the local anelastic compliance is lower than the global plastic compliance, deformation is mechanically recoverable, and vice versa. This hypothesis is corroborated with the classical Taylor relation. We report the relation between stable and unstable dislocation glide using this prototypical modelling framework. We find four structural variables, that are based on dislocation physics, to describe the stress–strain curve: total dislocation density, average dislocation segment length, dislocation junction formation rate, and average dislocation junction length. Firstly, we quantify the dislocation network evolution during uniaxial monotonic loading, and verify work-hardening by dislocation junction formation and a Taylor-type equation for flow. Finally, we present a semi-empirical relation for the evolution of the dislocation network structure. Which allows us to: refine the physical interpretation of the Taylor relationship, and rationalise experimental observations on apparent modulus degradation by thermomechanical processing. Both these findings circumvent the limitations of current, physics-based hardening models.@en

Uniformity in thickness and electronic properties of superconducting niobium titanium nitride (NbTiN) thin films is a critical issue for upscaling superconducting electronics, such as microwave kinetic inductance detectors for submillimeter wave astronomy. In this article we make an experimental comparison between the uniformity of NbTiN thin films produced by two DC magnetron sputtering systems with vastly different target sizes: the Nordiko 2000 equipped with a circular nothing 100 mm target, and the Evatec LLS801 with a rectangular target of 127 mm × 444.5 mm. In addition to the films deposited staticly in both systems, we have also deposited films in the LLS801 while shuttling the substrate in front of the target, with the aim of further enhancing the uniformity. Among these three setups, the LLS801 system with substrate shuttling has yielded the highest uniformity in film thickness (±2%), effective resistivity (decreasing by 5% from center to edge), and superconducting critical temperature (Tc = 15.0 K-15.3 K) over a ∅ 100 mm wafer. However, the shuttling appears to increase the resistivity by almost a factor of 2 compared to static deposition. Surface SEM inspections suggest that the shuttling could have induced a different mode of microstructural film growth.@en

Uniformity in thickness and electronic properties of superconducting niobium titanium nitride (NbTiN) thin films is a critical issue for upscaling superconducting electronics, such as microwave kinetic inductance detectors for submillimeter wave astronomy. In this article we make an experimental comparison between the uniformity of NbTiN thin films produced by two DC magnetron sputtering systems with vastly different target sizes: the Nordiko 2000 equipped with a circular nothing 100 mm target, and the Evatec LLS801 with a rectangular target of 127 mm × 444.5 mm. In addition to the films deposited staticly in both systems, we have also deposited films in the LLS801 while shuttling the substrate in front of the target, with the aim of further enhancing the uniformity. Among these three setups, the LLS801 system with substrate shuttling has yielded the highest uniformity in film thickness (±2%), effective resistivity (decreasing by 5% from center to edge), and superconducting critical temperature (Tc = 15.0 K-15.3 K) over a ∅ 100 mm wafer. However, the shuttling appears to increase the resistivity by almost a factor of 2 compared to static deposition. Surface SEM inspections suggest that the shuttling could have induced a different mode of microstructural film growth.@en

Uniformity in thickness and electronic properties of superconducting niobium titanium nitride (NbTiN) thin films is a critical issue for upscaling superconducting electronics, such as microwave kinetic inductance detectors for submillimeter wave astronomy. In this article we make an experimental comparison between the uniformity of NbTiN thin films produced by two DC magnetron sputtering systems with vastly different target sizes: the Nordiko 2000 equipped with a circular nothing 100 mm target, and the Evatec LLS801 with a rectangular target of 127 mm × 444.5 mm. In addition to the films deposited staticly in both systems, we have also deposited films in the LLS801 while shuttling the substrate in front of the target, with the aim of further enhancing the uniformity. Among these three setups, the LLS801 system with substrate shuttling has yielded the highest uniformity in film thickness (±2%), effective resistivity (decreasing by 5% from center to edge), and superconducting critical temperature (Tc = 15.0 K-15.3 K) over a ∅ 100 mm wafer. However, the shuttling appears to increase the resistivity by almost a factor of 2 compared to static deposition. Surface SEM inspections suggest that the shuttling could have induced a different mode of microstructural film growth.@en

A cellular automata (CA) model has been developed for solidification simulation considering the kinetic undercooling at the interface. The state-of-the-art model incorporates a decentered growth algorithm to suppress the grid anisotropy and a generalized height function method to calculate the curvature accurately. To develop a CA model which is independent of the mesh size, a new diffusion term is proposed to handle the diffusion between the interface cells and liquid cells. The developed CA model is employed to simulate the single-dendritic solidification of an Al–3Cu (wt pct) alloy. The simulated tip velocities agree with the prediction of the Kurz–Giovanola–Trivedi (KGT) model. Further studies show that the developed CA model converges to an equilibrium model with increasing kinetic mobility values. Moreover, it is found that the virtual liquid cell assumption which is commonly used in existing CA models may lead to a deviation in the mass balance. The mass balance error has been resolved by redistributing solutes from neighboring liquid cells in each time step. The developed CA model could be potentially used in solidification simulations with a high undercooling, which is common in welding and additive manufacturing.@en

In the present study, the nucleation of static recrystallization (SRX) in austenite after hot deformation is experimentally analyzed using a Ni-30 pct Fe model alloy. In agreement with the predictions by current models, nucleation rate exhibits a strong peak, early during SRX. Whereas such an early peak is explained by current models by the saturation of nucleation sites, this condition is far from reached, even after the peak declines. In addition, triple-junction and grain-boundary sites are shown to make a quantitatively similar contribution to nucleation. However, for a given boundary between deformed grains, nucleation predominantly starts at one of the triple junctions. Triple-junction nucleation initiates by strain-induced boundary migration of the nucleus (bulging) along one of the boundaries at the junction. Annealing twin boundaries contribute negligibly to nucleation through their grain-boundary sites. By contrast, their junctions with the boundaries of the parent grains do play a relevant role. The earlier nucleation at the triple junctions is attributed to the higher dislocation density observed around them, and the energy of the boundary consumed by the bulge. Both the maximum and average number of nuclei formed per boundary between deformed grains increase with increasing boundary length.@en