Ptychography as a means of lensless imaging is used in wafer metrology applications using Extreme Ultraviolet (EUV) light, where use of high quality optics is out-of-scope. To obtain sufficient diffraction intensity, reflection geometries with shallow (ca. 20 degrees) grazing incidence angles are used, which require re-sampling the diffraction data in a process called tilted plane correction (TPC). The tilt angle used for TPC is conventionally obtained through either experimentally tricky calibration, manual estimation based on diffraction pattern symmetry, although computational approaches are emerging. In this work we offer an improved numerical optimization approach as an alternative to TPC, where we use the flexibility offered by our Automatic Differentiation (AD)-based ptychography approach to include the data resampling into the forward model to learn the tilt angle. We demonstrate convergence of the approach across a range of incidence angles on simulated and experimental data obtained on an EUV beamline with either a high-harmonic generation (HHG)-based or a visible light source. ... Read more

Ptychography in a reflection geometry shows great promise for non-destructive imaging of 3-dimensional nanostructures at the surface of a thick substrate. A major challenge to obtain high quality reflection-ptychographic images under near-grazing conditions has been to calibrate the incidence angle used to straighten the measured curved diffraction patterns in a process referred to as ‘tilted plane correction’ (TPC). In this work, we leverage the flexibility of automatic differentiation (AD)-based modeling to realize an alternative approach, where the tilted propagation is included in the forward model. Use of AD allows us to jointly optimize the tilt angles with the typical probe and object, eliminating the need for accurate calibration or random search optimization. The approach was validated using datasets generated with an extreme ultraviolet (EUV) beamline based on both a tabletop high harmonic generation (HHG) source and a visible laser. We demonstrate that the proposed approach can converge to a precision of ±0.05◦ for probe beams at 70◦ angle of incidence, possibly precise enough for use as a calibration approach. Furthermore, we demonstrate that optimizing for the tilt angles reduces artifacts and increases reconstruction fidelity. Use of AD not only streamlines the current ptychographic reconstruction process, but should also enable optimization of more complex models in other domains, which will likely be useful for future advancements in computational imaging. ... Read more

Next-generation metrology solutions in various technology areas require to image sample areas at the nanoscale. Coherent diffractive imaging based on ptychography is the route towards EUV imaging of nanostructures without lenses. A key component in a table-top EUV beamline is a high-brightness high-harmonic generation (HHG) source. Since our research is mainly directed towards wafer metrology for lithography in the semiconductor industry, we adhere to a reflection setup: the EUV light is scattered by the nanostructures at the surface of the sample, and is reflected towards a CCD camera, where a far-field diffraction pattern is recorded. A data-set comprising a multitude of these diffraction patterns is generated for partially overlapping positions of the focused probe on the sample. This provides the necessary redundancy for phase retrieval of the complex-valued field of the sample. Recent advancements in both hardware and software for computation enable the development of advanced algorithms. In particular, the benefits of automatic differentiation are exploited in order to cope with a drastic growth in model complexity. Our computational imaging algorithms realize wavelengthmultiplexed reconstruction and a modal approach for the spatial coherence of the source. ... Read more