Board level reliability can be of high interest for automotive electronic components when exposed to vibration-prone environments. However, the absence of an industry standard for board level vibration testing poses several challenges in establishing a well-characterized test setup. One of the challenges is that automotive applications can induce abnormal stresses on components that can lead to early failures in the field. Such loading conditions are not always covered in the current board level vibration test methods. This paper aims to correlate the stresses from automotive modules to board levels by measuring the printed circuit board (PCB) vibration spectrum. Firstly, the study compares and assesses several module board level vibration measurement units, such as LASER Doppler Vibrometer (LDV), strain gauges, and accelerometers. Experiments and simulations show that LDV enables good correlation with Micro-electro Mechanical Systems (MEMS) accelerometers. Secondly, the module-board interaction unveils insights into several module design features that impact the PCB vibration response and solder joint interconnect reliability. These findings underscore the necessity for the user to correctly validate the reliability of packages beyond board level testing, i.e., at the module level. This reliability test approach enables the translation of reliability test results from the lab to the field life of components once built in the final application equipment.

ICON Far UltraViolet (FUV) imager contributes to the ICON science objectives by providing remote sensing measurements of the daytime and nighttime atmosphere/ionosphere. During sunlit atmospheric conditions, ICON FUV images the limb altitude profile in the shortwave (SW) band at 135.6 nm and the longwave (LW) band at 157 nm perpendicular to the satellite motion to retrieve the atmospheric O/N₂ ratio. In conditions of atmospheric darkness, ICON FUV measures the 135.6 nm recombination emission of O ⁺ ions used to compute the nighttime ionospheric altitude distribution. ICON Far UltraViolet (FUV) imager is a Czerny–Turner design Spectrographic Imager with two exit slits and corresponding back imager cameras that produce two independent images in separate wavelength bands on two detectors. All observations will be processed as limb altitude profiles. In addition, the ionospheric 135.6 nm data will be processed as longitude and latitude spatial maps to obtain images of ion distributions around regions of equatorial spread F. The ICON FUV optic axis is pointed 20 degrees below local horizontal and has a steering mirror that allows the field of view to be steered up to 30 degrees forward and aft, to keep the local magnetic meridian in the field of view. The detectors are micro channel plate (MCP) intensified FUV tubes with the phosphor fiber-optically coupled to Charge Coupled Devices (CCDs). The dual stack MCP-s amplify the photoelectron signals to overcome the CCD noise and the rapidly scanned frames are co-added to digitally create 12-second integrated images. Digital on-board signal processing is used to compensate for geometric distortion and satellite motion and to achieve data compression. The instrument was originally aligned in visible light by using a special grating and visible cameras. Final alignment, functional and environmental testing and calibration were performed in a large vacuum chamber with a UV source. The test and calibration program showed that ICON FUV meets its design requirements and is ready to be launched on the ICON spacecraft.