RB
R. Bokhorst
info
Please Note
<p>This page displays the records of the person named above and is not linked to a unique person identifier. This record may need to be merged to a profile.</p>
2 records found
1
Front-end Monolithic Microwave Integrated Circuits (MMICs) have recently become commercially available for frequencies above 100 GHz. However, achieving low-loss and broadband interconnections between the antenna and MMICs is challenging for integrated front ends at these frequencies. This thesis presents the characterization of a flip-chip interconnection used for an integrated front end at 150 GHz (G-band) with an on-package leaky-wave dual lens antenna. Two paths for the front-end integration have been proposed. The first path adopts CPW transmission lines on 500 μm-thick fused silica and provides easy assembly and seamless flip-chip capabilities. The second uses microstrip transmission lines on 50 μm-thick fused silica and provides lower transmission line loss but a challenging assembly and flip-chip interconnection. In this thesis, a path toward microstrip and CPW flip-chip interconnections has been outlined at the high millimeter-wave frequencies. Two-port test structures using CPW transmission lines were developed, adopting a double Thru-Reflect-Line calibration and allowing for accurate extracting of the interconnection response. The final interconnection to the MMICs has been realized using a via-less CPW to microstrip transition with high impedance transmission line S11 matching compensation. The simulated S11 and S22 are below -12 dB, Ohmic loss below 0.6 dB, radiation loss below 0.4 dB, and transmission line losses around 0.15 dB/mm.
...
Front-end Monolithic Microwave Integrated Circuits (MMICs) have recently become commercially available for frequencies above 100 GHz. However, achieving low-loss and broadband interconnections between the antenna and MMICs is challenging for integrated front ends at these frequencies. This thesis presents the characterization of a flip-chip interconnection used for an integrated front end at 150 GHz (G-band) with an on-package leaky-wave dual lens antenna. Two paths for the front-end integration have been proposed. The first path adopts CPW transmission lines on 500 μm-thick fused silica and provides easy assembly and seamless flip-chip capabilities. The second uses microstrip transmission lines on 50 μm-thick fused silica and provides lower transmission line loss but a challenging assembly and flip-chip interconnection. In this thesis, a path toward microstrip and CPW flip-chip interconnections has been outlined at the high millimeter-wave frequencies. Two-port test structures using CPW transmission lines were developed, adopting a double Thru-Reflect-Line calibration and allowing for accurate extracting of the interconnection response. The final interconnection to the MMICs has been realized using a via-less CPW to microstrip transition with high impedance transmission line S11 matching compensation. The simulated S11 and S22 are below -12 dB, Ohmic loss below 0.6 dB, radiation loss below 0.4 dB, and transmission line losses around 0.15 dB/mm.
Wireless passive weight sensor
Design and simulation of an RLC-resonance sensor for weight sensing in conveyor belts
This thesis presents a resonant sensor circuit design that converts the deformation of a load cell in a conveyor belt into a change in resonance frequency. The sensor is inductively coupled to a reader circuit using planar PCB inductor coils. A sensor circuit was designed, fitted on a square PCB with 14.14 mm side length. The circuit consists of a planar squared inductor and a planar interdigital capacitor. The inductor has an inductance of 0.66535 $\mu$H, and the capacitor has a capacitance of 5.157 pF. An additional SMD capacitor was added to reach a resonating frequency range around 27.2 MHz. The deformation of the load cell causes a bend in the sensor PCB, which is directly attached to the diaphragm of the load cell. The bend causes a change in capacitance of the interdigital capacitor, which shifts the resonance frequency of the sensor. The sensor components are designed in MATLAB and simulated and verified in CST studio.
...
This thesis presents a resonant sensor circuit design that converts the deformation of a load cell in a conveyor belt into a change in resonance frequency. The sensor is inductively coupled to a reader circuit using planar PCB inductor coils. A sensor circuit was designed, fitted on a square PCB with 14.14 mm side length. The circuit consists of a planar squared inductor and a planar interdigital capacitor. The inductor has an inductance of 0.66535 $\mu$H, and the capacitor has a capacitance of 5.157 pF. An additional SMD capacitor was added to reach a resonating frequency range around 27.2 MHz. The deformation of the load cell causes a bend in the sensor PCB, which is directly attached to the diaphragm of the load cell. The bend causes a change in capacitance of the interdigital capacitor, which shifts the resonance frequency of the sensor. The sensor components are designed in MATLAB and simulated and verified in CST studio.