ML
M.C. Louwerse
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4 records found
1
We demonstrate a stand-alone optical data link module (ODLM) that fits in the limited space budget of smart imaging catheters. The module is based on an extension of the Flex-to-Rigid (F2R) technology platform for miniaturized system integration. The ODLM is a silicon-based interposer that comprises a commercially available Vertical Cavity Surface Emitting Laser (VCSEL), which has its electrical contacts and laser emitting spot on the same surface. With the flexible interconnects, the ODLM reroutes the flip-chipped VCSEL electrical contacts to the side that is perpendicular to the surface of the VCSEL. This enables the ODLM to be mounted on a flex-PCB and fit into the limited space in the distal tip of the smart catheter. An optical fiber that runs in parallel to the catheter shaft is inserted into the through-silicon hole (TSH) of the ODLM and self-aligned to the VCSEL for optical data transmission. The design of the ODLM and the F2R technology platform are introduced, and an ODLM demonstrator is fabricated and presented.
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We demonstrate a stand-alone optical data link module (ODLM) that fits in the limited space budget of smart imaging catheters. The module is based on an extension of the Flex-to-Rigid (F2R) technology platform for miniaturized system integration. The ODLM is a silicon-based interposer that comprises a commercially available Vertical Cavity Surface Emitting Laser (VCSEL), which has its electrical contacts and laser emitting spot on the same surface. With the flexible interconnects, the ODLM reroutes the flip-chipped VCSEL electrical contacts to the side that is perpendicular to the surface of the VCSEL. This enables the ODLM to be mounted on a flex-PCB and fit into the limited space in the distal tip of the smart catheter. An optical fiber that runs in parallel to the catheter shaft is inserted into the through-silicon hole (TSH) of the ODLM and self-aligned to the VCSEL for optical data transmission. The design of the ODLM and the F2R technology platform are introduced, and an ODLM demonstrator is fabricated and presented.
Journal article
(2018)
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Angel Savov, Shivani Joshi, Salman Shafqat, Johan Hoefnagels, Marcus Louwerse, Ronald Stoute, Ronald Dekker
A device for studying the mechanical and electrical behavior of free-standing micro-fabricated metal structures, subjected to a very large deformation, is presented in this paper. The free-standing structures are intended to serve as interconnects in high-density, highly stretchable electronic circuits. For an easy, damage-free handling and mounting of these free-standing structures, the device is designed to be fabricated as a single chip/unit that is separated into two independently movable parts after it is fixed in the tensile test stage. Furthermore, the fabrication method allows for test structures of different geometries to be easily fabricated on the same substrate. The utility of the device has been demonstrated by stretching the free-standing interconnect structures in excess of 1000% while simultaneously measuring their electrical resistance. Important design considerations and encountered processing challenges and their solutions are discussed in this paper.
...
A device for studying the mechanical and electrical behavior of free-standing micro-fabricated metal structures, subjected to a very large deformation, is presented in this paper. The free-standing structures are intended to serve as interconnects in high-density, highly stretchable electronic circuits. For an easy, damage-free handling and mounting of these free-standing structures, the device is designed to be fabricated as a single chip/unit that is separated into two independently movable parts after it is fixed in the tensile test stage. Furthermore, the fabrication method allows for test structures of different geometries to be easily fabricated on the same substrate. The utility of the device has been demonstrated by stretching the free-standing interconnect structures in excess of 1000% while simultaneously measuring their electrical resistance. Important design considerations and encountered processing challenges and their solutions are discussed in this paper.
Intravascular Ultrasound at the Tip of a Guidewire
Concept and First Assembly Steps
Minimally invasive surgery of the most lethal disease worldwide, coronary artery disease, benefits from better diagnostic tools during the treatment. With this in mind, a novel concept is introduced for intravascular ultrasound on a 360 μm diameter guidewire. The complex manufacture of this medical instrument, and other devices that require extreme miniaturization, will benefit from our previously presented Flex-to-Rigid assembly platform. However, currently the scalability of this technology is limited by etch-dependent effects. But with an innovation on the process flow presented here, the required smaller, well-defined, arbitrary shaped rigid islands with flexible interconnects between them were fabricated, therefore making it possible to manufacture this device.
...
Minimally invasive surgery of the most lethal disease worldwide, coronary artery disease, benefits from better diagnostic tools during the treatment. With this in mind, a novel concept is introduced for intravascular ultrasound on a 360 μm diameter guidewire. The complex manufacture of this medical instrument, and other devices that require extreme miniaturization, will benefit from our previously presented Flex-to-Rigid assembly platform. However, currently the scalability of this technology is limited by etch-dependent effects. But with an innovation on the process flow presented here, the required smaller, well-defined, arbitrary shaped rigid islands with flexible interconnects between them were fabricated, therefore making it possible to manufacture this device.