A device for studying the mechanical and electrical behavior of free-standing micro-fabricated metal structures, subjected to a very large deformation, is presented in this paper. The free-standing structures are intended to serve as interconnects in high-density, highly stretchable electronic circuits. For an easy, damage-free handling and mounting of these free-standing structures, the device is designed to be fabricated as a single chip/unit that is separated into two independently movable parts after it is fixed in the tensile test stage. Furthermore, the fabrication method allows for test structures of different geometries to be easily fabricated on the same substrate. The utility of the device has been demonstrated by stretching the free-standing interconnect structures in excess of 1000% while simultaneously measuring their electrical resistance. Important design considerations and encountered processing challenges and their solutions are discussed in this paper.@en

This paper presents a new method for the CMOS compatible fabrication of microchannels integrated into a silicon substrate. In a single-step DRIE process (Deep Reactive Ion Etching) a network of microchannels with High Aspect Ratio (HAR) up to 10, can be etched in a silicon substrate through a mesh mask. In the same single etching step, multidimensional microchannels with various dimensions (width, length, and depth) can be obtained by tuning the process and design parameters. These fully embedded structures enable further wafer processing and integration of electronic components like sensors and actuators in wafers with microchannels. @en

As the connection at the proximal tip plays an important role for sensing guidewires, we compared various sensing guidewires with regard to their proximal connectors. The strengths and weaknesses of each are discussed and recommendations for future development are provided. A literature search limited to the English language for the time period from the 1960s to the 2010s has been performed on the USPTO database, Espacenet, and Web of Science. The results have been categorized on the basis of the connector design. A comprehensive overview and classification of proximal connectors for sensing guidewires used for cardiovascular interventions is presented. The classification is based on both the type of connector (fixed or removable) and the type of connection (physical, wireless, or a combination). Considering the complexity of the currently prototyped and tested connectors, future connector development will necessitate an easy and cost-effective manufacturing process that can ensure safe and robust connections.@en

Microfluidics has been identified as a revolutionizing technology for chemistry and biology, enabling cost-effective semi-automated experiments without extensive laboratory infrastructure. However, the complexity and number of simultaneous experiments is limited with current fabrication approaches. We present a novel CMOS compatible process to fabricate embedded microchannels that can greatly enhance the functionality and scalability of microfluidic experimentation. The feasibility of the fabrication process is demonstrated with a device to probe mechanical properties of cells before and after presenting them a stimulus.@en

Minimally invasive surgery of the most lethal disease worldwide, coronary artery disease, benefits from better diagnostic tools during the treatment. With this in mind, a novel concept is introduced for intravascular ultrasound on a 360 μm diameter guidewire. The complex manufacture of this medical instrument, and other devices that require extreme miniaturization, will benefit from our previously presented Flex-to-Rigid assembly platform. However, currently the scalability of this technology is limited by etch-dependent effects. But with an innovation on the process flow presented here, the required smaller, well-defined, arbitrary shaped rigid islands with flexible interconnects between them were fabricated, therefore making it possible to manufacture this device.@en