Thin-film MEMS encapsulation using low-stress PECVD silicon carbide
Conference Paper
(2008)
Author(s)
V Rajaraman (TU Delft - Electronic Instrumentation)
L Pakula (TU Delft - Electronic Instrumentation)
HTM Pham (TU Delft - Old - EWI Sect. ECTM)
Pasqualina Maria Sarro (TU Delft - Electronic Components, Technology and Materials)
P. J. French (TU Delft - Electronic Instrumentation)
Research Group
Electronic Instrumentation
To reference this document use:
https://resolver.tudelft.nl/uuid:07727a73-acd2-489e-a599-9b9c5d933586
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Publication Year
2008
Research Group
Electronic Instrumentation
Pages (from-to)
491-494
ISBN (print)
ISBN 978-3-00-025217-4
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