Design, Fabrication, and Characterization of a 4H-SiC CMOS Readout Circuit for Monolithic Integration with SiC Sensors

Conference Paper (2023)
Author(s)

Romina Sattari (TU Delft - Electrical Engineering, Mathematics and Computer Science)

Henk van Zeijl (TU Delft - Electrical Engineering, Mathematics and Computer Science)

Guoqi Zhang (TU Delft - Electrical Engineering, Mathematics and Computer Science)

Research Group
Electronic Components, Technology and Materials
DOI related publication
https://doi.org/10.23919/EMPC55870.2023.10418435 Final published version
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Publication Year
2023
Language
English
Research Group
Electronic Components, Technology and Materials
Pages (from-to)
1-3
ISBN (print)
978-1-6654-8736-8
ISBN (electronic)
978-0-9568086-9-1
Event
2023 24th European Microelectronics and Packaging Conference & Exhibition (EMPC) (2023-09-11 - 2023-09-14), Cambridge, United Kingdom
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Abstract

This paper reports the design and fabrication of a 4H-SiC CMOS readout circuit enabling monolithic integration of silicon carbide (SiC) sensors and circuits. Compared to conventional Si electronics, 4H-SiC integrated circuits can sustain operation in harsh conditions such as higher temperatures and radiation levels. The proposed amplifier performance is well balanced through the temperature range of 25 °C to 400 °C. Compared to state-of-the-art, the proposed SiC readout circuit does not include any off-chip components. The amplifier is fully differential, and hence shows improved common-mode rejection and signal-to-noise ratio (SNR). It can be monolithically integrated with SiC sensors in a scalable SiC technology.

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