Numerical thermal analysis and optimization of multi-chip LED module using response surface methodology and genetic algorithm

Journal article (2017)

Authors

H. Tang Electronic Components, Technology and Materials -

Huai Yu Ye Chongqing University

Xian Ping Chen Chongqing University

Cheng Qian Chinese Academy of Sciences, Changzhou Institute of Technology Research for Solid State Lighting

Xuejun Fan Lamar University

Kouchi Zhang Electronic Components, Technology and Materials -

Research Group

Electronic Components, Technology and Materials () (TU Delft)

DOI

https://doi.org/10.1109/ACCESS.2017.2737638

Optimization Genetic algorithm Thermal resistance Response surface methodology OA-Fund TU Delft Multi-chip LED module

More Info

expand_more

To reference this document use:

http://resolver.tudelft.nl/uuid:1397c49e-4df9-4ff2-84d7-6a8511757062

Published Date

09-08-2017

Language

English

Reuse Rights

Other than for strictly personal use, it is not permitted to download, forward or distribute the text or part of it, without the consent of the author(s) and/or copyright holder(s), unless the work is under an open content license such as Creative Commons.

Faculty

Electrical Engineering, Mathematics and Computer Science

Department

Microelectronics

Research Group

Electronic Components, Technology and Materials

Abstract

In this paper, the heat transfer performance of the multi-chip (MC) LED module is investigated numerically by using a general analytical solution. The configuration of the module is optimized with genetic algorithm (GA) combined with a response surface methodology. The space between chips, the thickness of the metal core printed circuit board (MCPCB), and the thickness of the base plate are considered as three optimal parameters, while the total thermal resistance (Rtot) is considered as a single objective function. After optimizing objectives with GA, the optimal design parameters of three types of MC LED modules are determined. The results show that the thickness of MCPCB has a stronger influence on the total thermal resistance than other parameters. In addition, the sensitivity analysis is performed based on the optimum data. It reveals thatRtot increases with the increased thickness of MCPCB, and reduces as the space between chips increases. The effect of the thickness of base plate is far less than that of the thickness of MCPCB. After optimization, three types of MC LED modules obtain lower Tj andRtot. Moreover, the optimized modules can emit large luminous energy under high-power input conditions. Therefore, the optimization results are of great significance in the selection of configuration parameters to improve the performance of the MC LED module.

Files

08006225.pdf

(.pdf | 21.1 Mb)