AI-Driven Digital Twin for Health Monitoring of Wide Band Gap Power Semiconductors

Conference Paper (2024)
Author(s)

Alireza Mehrabi (TU Delft - Electrical Engineering, Mathematics and Computer Science)

Keyvan Yari (TU Delft - Electrical Engineering, Mathematics and Computer Science)

Willem D. Van Driel (TU Delft - Electrical Engineering, Mathematics and Computer Science)

Rene H. Poelma (TU Delft - Electrical Engineering, Mathematics and Computer Science)

Research Group
Electronic Components, Technology and Materials
DOI related publication
https://doi.org/10.1109/ESTC60143.2024.10712146 Final published version
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Publication Year
2024
Language
English
Research Group
Electronic Components, Technology and Materials
ISBN (print)
979-8-3503-9037-7
ISBN (electronic)
979-8-3503-9036-0
Event
10th IEEE Electronics System-Integration Technology Conference, ESTC 2024 (2024-09-11 - 2024-09-13), Berlin, Germany
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Abstract

A significant challenge in the implementation of health monitoring systems for estimating the health state of devices is the lack of accurate information about design details. This challenge is particularly prominent in the field of power electronics, where both IC designers and converter designers are often hesitant to share information about their designs. Addressing this issue, this paper introduces a novel AI-driven digital twin modeling methodology that enables the detection and classification of failures in power semiconductors, particularly Wide Band Gap semiconductors. By employing AI-based system identification techniques, this method offers a noninvasive approach to health monitoring of power switches with high resolution, even while operating under real conditions. The proposed method has been validated by simulating wire bond failure in a SiC power MOSFET using MATLAB SIMULINK, and the results demonstrate its accuracy.

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