Fighting Dark Silicon

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Fighting Dark Silicon

Toward Realizing Efficient Thermal-Aware 3-D Stacked Multiprocessors

Journal Article (2017)

Author(s)

Sumeet S. Kumar (TU Delft - Electrical Engineering, Mathematics and Computer Science)

Amir Zjajo (TU Delft - Electrical Engineering, Mathematics and Computer Science)

Rene van Leuken (TU Delft - Electrical Engineering, Mathematics and Computer Science)

Research Group

Signal Processing Systems

Memory management 3-D integrated circuits Design for quality Multicore processing System-level design

DOI related publication

https://doi.org/10.1109/TVLSI.2016.2642587 Final published version

To reference this document use

https://resolver.tudelft.nl/uuid:22138323-270b-425e-817f-683f6420e42f

More Info

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Publication Year

2017

Language

English

Research Group

Signal Processing Systems

Issue number

4

Volume number

25

Pages (from-to)

1549-1562

Downloads counter

215

Abstract

This paper investigates the challenges of dark silicon that impede the performance and reliability of 3-D stacked multiprocessors. It presents a multipronged approach toward addressing the thermal issues arising from high-density integration in die stacks, spanning architectural techniques, design methodologies, and runtime temperature management. Importantly, this paper provides novel insights into the causes of hotspot formation in 3-D ICs and details a practical approach toward exploring and mitigating performance-limiting thermal behavior early in the system design flow.