Fighting Dark Silicon

Toward Realizing Efficient Thermal-Aware 3-D Stacked Multiprocessors

Journal article (2017)

Authors

S.S. Kumar Signal Processing Systems - EEMCS
Amir Zjajo Signal Processing Systems - EEMCS
T.G.R.M. van Leuken Signal Processing Systems - EEMCS
Research Group
Signal Processing Systems (EEMCS) (TU Delft)
Memory management 3-D integrated circuits Design for quality Multicore processing System-level design
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Published Date

2017

Language

English

Reuse Rights

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Faculty

Electrical Engineering, Mathematics and Computer Science

Department

Microelectronics

Research Group

Signal Processing Systems

Abstract

This paper investigates the challenges of dark silicon that impede the performance and reliability of 3-D stacked multiprocessors. It presents a multipronged approach toward addressing the thermal issues arising from high-density integration in die stacks, spanning architectural techniques, design methodologies, and runtime temperature management. Importantly, this paper provides novel insights into the causes of hotspot formation in 3-D ICs and details a practical approach toward exploring and mitigating performance-limiting thermal behavior early in the system design flow.

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