Through-wafer electrical vias for RF silicon technology

Conference paper (2003)

Authors

Z Wang Old - EWI Ch. Integrated Sensing Devices
L Wang Electronic Components, Technology and Materials - EEMCS
H. Schellevis Electronic Components, Technology and Materials - EEMCS
W.H.A. Wien Electronic Components, Technology and Materials - EEMCS
JN Burghartz Old - EWI Ch. Integrated Sensing Devices
Pasqualina M Sarro Electronic Components, Technology and Materials - EEMCS
Research Group
Old - EWI Ch. Integrated Sensing Devices
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Published Date

2003

Language

Undefined/Unknown

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Research Group

Old - EWI Ch. Integrated Sensing Devices