Through-wafer electrical vias for RF silicon technology
Conference Paper
(2003)
Author(s)
Z Wang (TU Delft - Old - EWI Ch. Integrated Sensing Devices)
L Wang (TU Delft - Electronic Components, Technology and Materials)
H Schellevis (TU Delft - Electronic Components, Technology and Materials)
W.H.A. Wien (TU Delft - Electronic Components, Technology and Materials)
JN Burghartz (TU Delft - Old - EWI Ch. Integrated Sensing Devices)
Lina P.M. Sarro (TU Delft - Electronic Components, Technology and Materials)
Research Group
Old - EWI Ch. Integrated Sensing Devices
To reference this document use:
https://resolver.tudelft.nl/uuid:25ca0ea0-9b8d-4426-b405-79fe3a108949
More Info
expand_more
expand_more
Publication Year
2003
Research Group
Old - EWI Ch. Integrated Sensing Devices
Pages (from-to)
761-765
ISBN (print)
90-73461-39-1
No files available
Metadata only record. There are no files for this record.