Implementation of Fully Coupled Electromigration Theory in COMSOL

Conference Paper (2022)
Authors

Z. Cui (TU Delft - Electronic Components, Technology and Materials)

Xuejun Fan (Lamar University, TU Delft - Electronic Components, Technology and Materials)

Guo Qi Z Zhang (TU Delft - Electronic Components, Technology and Materials)

Research Group
Electronic Components, Technology and Materials
Copyright
© 2022 Z. Cui, X. Fan, Kouchi Zhang
To reference this document use:
https://doi.org/10.1109/ECTC51906.2022.00046
More Info
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Publication Year
2022
Language
English
Copyright
© 2022 Z. Cui, X. Fan, Kouchi Zhang
Research Group
Electronic Components, Technology and Materials
Pages (from-to)
233-238
ISBN (print)
978-1-6654-7944-8
ISBN (electronic)
978-1-6654-7943-1
DOI:
https://doi.org/10.1109/ECTC51906.2022.00046
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Abstract

In this paper, a 3D and fully coupled electromigration modeling is implemented using COMSOL. The fully coupled multi-physics theory has a unique set of partial differential equations, which cannot be directly simulated with the standard finite element software such as ABAQUS and ANSYS. With the weak form PDE modulus in COMSOL, the weak form of the governing equations is obtained and realized for a 3D finite element modeling of electromigration. The metal lines under totally constrained and stress-free conditions with a perfectly blocking condition are presented as benchmark problems, in which the finite element solutions are in excellent agreement with the analytical solutions.

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