Chitosan Oligosaccharide Laser Lithograph
A Facile Route to Porous Graphene Electrodes for Flexible On-Chip Microsupercapacitors
Qian Ming Huang (Southern University of Science and Technology , Harbin Institute of Technology)
Huiru Yang (Harbin Institute of Technology, Southern University of Science and Technology )
Shaogang Wang (TU Delft - Bio-Electronics, Southern University of Science and Technology )
Xu Liu (TU Delft - Electronic Components, Technology and Materials, Southern University of Science and Technology )
Chunjian Tan (Southern University of Science and Technology , TU Delft - Electronic Components, Technology and Materials)
Qihang Zong (Southern University of Science and Technology )
Paddy French (TU Delft - Bio-Electronics)
Guoqi Zhang (TU Delft - Electronic Components, Technology and Materials)
Huaiyu Ye (TU Delft - Electronic Components, Technology and Materials, Southern University of Science and Technology )
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Abstract
In this study, a convenient chitosan oligosaccharide laser lithograph (COSLL) technology was developed to fabricate laser-induced graphene (LIG) electrodes and flexible on-chip microsupercapacitors (MSCs). With a simple one-step CO2 laser, the pyrolysis of a chitosan oligosaccharide (COS) and in situ welding of the generated LIGs to engineering plastic substrates are achieved simultaneously. The resulting LIG products display a hierarchical porous architecture, excellent electrical conductivity (6.3 Ω sq-1), and superhydrophilic properties, making them ideal electrode materials for MSCs. The pyrolysis-welding coupled mechanism is deeply discussed through cross-sectional analyses and finite element simulations. The MSCs prepared by COSLL exhibit considerable areal capacitance of over 4 mF cm-2, which is comparable to that of the polyimide-LIG-based counterpart. COSLL is also compatible with complementary metal-oxide-semiconductor (CMOS) and micro-electro-mechanical system (MEMS) processes, enabling the fabrication of LIG/Au MSCs with comparable areal capacitance and lower internal resistance. Furthermore, the as-prepared MSCs demonstrate excellent mechanical robustness, long-cycle capability, and ease of series-parallel integration, benefiting their practical application in various scenarios. With the use of eco-friendly biomass carbon source and convenient process flowchart, the COSLL emerges as an attractive method for the fabrication of flexible LIG on-chip MSCs and various other advanced LIG devices.