Processability and electrical characteristic of glass substrates for RF wafer-level chip-scale packages

Conference paper (2003)

Authors

A Poliakov Old - EWI Ch. Integrated Sensing Devices
P Mendes Electronic Components, Technology and Materials - EEMCS
SM Sinaga Old - EWI Ch. Integrated Sensing Devices
B. Rajaei Salmasi Old - EWI Ch. Integrated Sensing Devices
JH Correia External organisation
JN Burghartz Old - EWI Ch. Integrated Sensing Devices
Research Group
Old - EWI Ch. Integrated Sensing Devices
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Published Date

2003

Language

Undefined/Unknown

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Research Group

Old - EWI Ch. Integrated Sensing Devices